WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Options
Query Language
Stem
Sort by:
List Length
Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2016058885) MOLDED PACKAGE AND METHOD OF MANUFACTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2016/058885 International Application No.: PCT/EP2015/073134
Publication Date: 21.04.2016 International Filing Date: 07.10.2015
IPC:
H01L 21/56 (2006.01) ,H01L 33/48 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
Applicants: KONINKLIJKE PHILIPS N.V.[NL/NL]; High Tech Campus 5 5656 AE Eindhoven, NL
Inventors: LIU, Yun; DE
LEE, Yuhua; DE
KU, Chengsheng; DE
LIU, Chingming; DE
ZHU, Mengming; DE
GOLUBOVIC, Dusan; DE
HUANG, Yujie; DE
Agent: RUEBER, Bernhard; DE
Priority Data:
14191281.631.10.2014EP
PCT/CN2014/00090013.10.2014CN
Title (EN) MOLDED PACKAGE AND METHOD OF MANUFACTURE
(FR) BOÎTIER MOULÉ ET SON PROCÉDÉ DE FABRICATION
Abstract:
(EN) A package is manufactured by placing a substrate (10), for example a lead frame, in a mold (30) with a protection flange (38) extending into a notch (14) in the substrate (10) around a contact surface (12). The protection flange (38) impedes molding compound from reaching the contact surface reducing the need for a deflash step.
(FR) On fabrique un boîtier en plaçant un substrat (10), par exemple un cadre de montage, dans un moule (30) à joue de protection (38) s'étendant dans une encoche (14) formée dans le substrat (10) autour d'une surface de contact (12). La joue de protection (38) empêche le composé de moulage (38) d'atteindre la surface de contact et réduit ainsi la nécessité de recourir à une étape d'ébavurage.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)