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1. (WO2016058885) MOLDED PACKAGE AND METHOD OF MANUFACTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/058885    International Application No.:    PCT/EP2015/073134
Publication Date: 21.04.2016 International Filing Date: 07.10.2015
IPC:
H01L 21/56 (2006.01), H01L 33/48 (2010.01)
Applicants: KONINKLIJKE PHILIPS N.V. [NL/NL]; High Tech Campus 5 5656 AE Eindhoven (NL)
Inventors: LIU, Yun; (DE).
LEE, Yuhua; (DE).
KU, Chengsheng; (DE).
LIU, Chingming; (DE).
ZHU, Mengming; (DE).
GOLUBOVIC, Dusan; (DE).
HUANG, Yujie; (DE)
Agent: RUEBER, Bernhard; (DE)
Priority Data:
PCT/CN2014/000900 13.10.2014 CN
14191281.6 31.10.2014 EP
Title (EN) MOLDED PACKAGE AND METHOD OF MANUFACTURE
(FR) BOÎTIER MOULÉ ET SON PROCÉDÉ DE FABRICATION
Abstract: front page image
(EN)A package is manufactured by placing a substrate (10), for example a lead frame, in a mold (30) with a protection flange (38) extending into a notch (14) in the substrate (10) around a contact surface (12). The protection flange (38) impedes molding compound from reaching the contact surface reducing the need for a deflash step.
(FR)On fabrique un boîtier en plaçant un substrat (10), par exemple un cadre de montage, dans un moule (30) à joue de protection (38) s'étendant dans une encoche (14) formée dans le substrat (10) autour d'une surface de contact (12). La joue de protection (38) empêche le composé de moulage (38) d'atteindre la surface de contact et réduit ainsi la nécessité de recourir à une étape d'ébavurage.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)