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1. (WO2016056387) HIGH-FREQUENCY COMMUNICATION MODULE AND HIGH-FREQUENCY COMMUNICATION DEVICE

Pub. No.:    WO/2016/056387    International Application No.:    PCT/JP2015/076865
Publication Date: Fri Apr 15 01:59:59 CEST 2016 International Filing Date: Fri Sep 25 01:59:59 CEST 2015
IPC: H01Q 21/28
H01L 23/12
H01Q 1/24
H05K 3/46
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: SUDO, Kaoru
須藤 薫
MIZUNUMA, Ryuken
水沼 隆賢
Title: HIGH-FREQUENCY COMMUNICATION MODULE AND HIGH-FREQUENCY COMMUNICATION DEVICE
Abstract:
 A high-frequency electronic component is disposed between a first substrate and a second substrate. The high-frequency electronic component is sealed by a mold member filled between the first substrate and the second substrate. A first antenna is formed on the outer-side surface of the first substrate. A second antenna is formed on the outer-side surface of the second substrate. A first signal path connects the high-frequency electronic component and the first antenna. A second signal path connects the high-frequency electronic component and the second antenna. There is provided a high-frequency communication module that is mounted on a motherboard, said module making it possible to radiate radio waves on both sides of the motherboard.