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1. (WO2016056286) SEMICONDUCTOR DEVICE INCLUDING HEAT-CONDUCTIVE SILICONE GREASE

Pub. No.:    WO/2016/056286    International Application No.:    PCT/JP2015/070583
Publication Date: Fri Apr 15 01:59:59 CEST 2016 International Filing Date: Sat Jul 18 01:59:59 CEST 2015
IPC: H01L 23/36
C08K 3/08
C08L 83/04
Applicants: SHIN-ETSU CHEMICAL CO., LTD.
信越化学工業株式会社
Inventors: YAMADA Kunihiro
山田 邦弘
Title: SEMICONDUCTOR DEVICE INCLUDING HEAT-CONDUCTIVE SILICONE GREASE
Abstract:
The present invention provides a highly reliable semiconductor device that includes a heat-conductive silicone grease composition and that constantly exhibits a superior heat dissipation effect even under a high-temperature, high-humidity environment. This semiconductor device has a heat-conductive silicone grease composition between a heat-generating electronic component and a heat-dissipating member and is characterized in that the heat-conductive silicone grease composition is shielded from outside air.