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Machine translation
1. (WO2016053821) COMPUTING DEVICE BONDING ASSEMBLIES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/053821    International Application No.:    PCT/US2015/052541
Publication Date: 07.04.2016 International Filing Date: 28.09.2015
Chapter 2 Demand Filed:    17.03.2016    
IPC:
G06F 1/16 (2006.01), H05K 5/06 (2006.01), C09J 5/06 (2006.01), B29C 65/02 (2006.01), B29C 65/48 (2006.01)
Applicants: MICROSOFT TECHNOLOGY LICENSING, LLC [US/US]; Attn: Patent Group Docketing (Bldg. 8/1000) One Microsoft Way Redmond, Washington 98052-6399 (US)
Inventors: DIGHDE, Rajesh; (US).
SULLIVAN, Tim M.; (US)
Agent: MINHAS, Sandip; (US).
OLSWANG LLP; Justin Hill 90 High Holborn London WC1V 6XX (GB)
Priority Data:
14/503,225 30.09.2014 US
Title (EN) COMPUTING DEVICE BONDING ASSEMBLIES
(FR) ENSEMBLES DE LIAISON DE DISPOSITIFS INFORMATIQUES
Abstract: front page image
(EN)The description relates to computing devices, such as mobile computing devices. One example can include a first portion, a second portion, and an adhesive. The example can also include micro heaters positioned proximate to the adhesive. The micro heaters are configured to be selectively energized to supply sufficient thermal energy to the adhesive to facilitate curing of the adhesive.
(FR)L'invention concerne des dispositifs informatiques, tels que des dispositifs informatiques mobiles. Un exemple peut comprendre une première partie, une seconde partie, et un adhésif. L'exemple peut également comprendre des micro-éléments chauffants positionnés à proximité de l'adhésif. Les micro-éléments chauffants sont conçus pour être sélectivement alimentés de façon à fournir suffisamment d'énergie thermique à l'adhésif pour faciliter le durcissement de l'adhésif.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)