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1. (WO2016052727) ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD FOR PRODUCING HIGH-PURITY COPPER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/052727    International Application No.:    PCT/JP2015/078050
Publication Date: 07.04.2016 International Filing Date: 02.10.2015
IPC:
C25C 1/12 (2006.01)
Applicants: MITSUBISHI MATERIALS CORPORATION [JP/JP]; 3-2, Otemachi 1-chome, Chiyoda-ku, Tokyo 1008117 (JP)
Inventors: KUBOTA Kenji; (JP).
TARUTANI Yoshie; (JP).
NAKAYA Kiyotaka; (JP)
Agent: SHIGA Masatake; (JP)
Priority Data:
2014-205311 04.10.2014 JP
2015-169880 29.08.2015 JP
Title (EN) ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD FOR PRODUCING HIGH-PURITY COPPER
(FR) ADDITIF POUR AFFINAGE ÉLECTROLYTIQUE DE CUIVRE DE HAUTE PURETÉ ET PROCÉDÉ POUR PRODUIRE UN CUIVRE DE HAUTE PURETÉ
(JA) 高純度銅電解精錬用添加剤と高純度銅の製造方法
Abstract: front page image
(EN)This additive for high-purity copper electrolytic refining is an additive that is added into a copper electrolyte solution in electrolytic refining for high-purity copper, and is composed of a nonionic surfactant which has a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group.
(FR)L'invention concerne un additif pour affinage électrolytique de cuivre de haute pureté qui est un additif qui est ajouté dans une solution d'électrolyte de cuivre lors d'un affinage électrolytique de cuivre de haute pureté, et est composé d'un tensioactif non ionique qui a un groupe hydrophobe contenant un cycle aromatique et un groupe hydrophile contenant un groupe polyoxyalkylène.
(JA) 本発明の高純度銅電解精錬用添加剤は、高純度銅の電解精錬における銅電解液に添加される添加剤であって、芳香族環を含む疎水基とポリオキシアルキレン基を含む親水基とを有する非イオン性界面活性剤からなる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)