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|1. (WO2016052664) RESIN COMPOSITION|
The resin composition according to the present invention can maintain a reasonable pot life and maintain the conductivity of a filler. The resin composition according to the present invention has excellent adhesive strength. The resin composition according to the present invention can suppress peeling of a hardened material during a high-temperature process. The resin composition according to the present invention is suitable for use as a die-attach paste or an adhesive for a heat radiation member. The resin composition comprises: (A) a filler having a conductive material on the surface of an insulating core material; (B) a thermosetting resin; (C) a curing agent; and (D) a thioether compound. The present invention relates to an adhesive for a heat radiation member or a die-attach paste, the adhesive comprising the resin composition. The present invention relates to a semiconductor device manufactured using the adhesive for a heat radiation member or die-attach paste.