Search International and National Patent Collections

1. (WO2016052664) RESIN COMPOSITION

Pub. No.:    WO/2016/052664    International Application No.:    PCT/JP2015/077852
Publication Date: Fri Apr 08 01:59:59 CEST 2016 International Filing Date: Thu Oct 01 01:59:59 CEST 2015
IPC: C08L 101/00
C08K 5/098
C08K 5/372
C08K 9/02
C09J 201/00
H01B 1/22
H01L 21/52
H01L 23/36
Applicants: NAMICS CORPORATION
ナミックス株式会社
Inventors: MIZUMURA, Noritsuka
水村 宜司
FUKAZAWA, Kazuki
深澤 和樹
Title: RESIN COMPOSITION
Abstract:
 The resin composition according to the present invention can maintain a reasonable pot life and maintain the conductivity of a filler. The resin composition according to the present invention has excellent adhesive strength. The resin composition according to the present invention can suppress peeling of a hardened material during a high-temperature process. The resin composition according to the present invention is suitable for use as a die-attach paste or an adhesive for a heat radiation member. The resin composition comprises: (A) a filler having a conductive material on the surface of an insulating core material; (B) a thermosetting resin; (C) a curing agent; and (D) a thioether compound. The present invention relates to an adhesive for a heat radiation member or a die-attach paste, the adhesive comprising the resin composition. The present invention relates to a semiconductor device manufactured using the adhesive for a heat radiation member or die-attach paste.