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1. (WO2016052384) PATTERN FORMATION METHOD, COMPOSITION FOR FORMING OVERLAY FILM, RESIST PATTERN, AND METHOD FOR PRODUCING ELECTRONIC DEVICE

Pub. No.:    WO/2016/052384    International Application No.:    PCT/JP2015/077275
Publication Date: Fri Apr 08 01:59:59 CEST 2016 International Filing Date: Tue Sep 29 01:59:59 CEST 2015
IPC: G03F 7/11
G03F 7/32
G03F 7/38
H01L 21/027
G03F 7/038
G03F 7/039
Applicants: FUJIFILM CORPORATION
富士フイルム株式会社
Inventors: GOTO Akiyoshi
後藤 研由
INOUE Naoki
井上 尚紀
YAMAMOTO Kei
山本 慶
TANGO Naohiro
丹呉 直紘
SHIRAKAWA Michihiro
白川 三千紘
Title: PATTERN FORMATION METHOD, COMPOSITION FOR FORMING OVERLAY FILM, RESIST PATTERN, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Abstract:
Provided are: a pattern formation method that has good DOF, EL, and watermark defect performance; a resist pattern that is formed by said pattern formation method; a composition for forming an overlay film, said composition being used in said pattern formation method; and a method for producing an electronic device that includes said pattern formation method. The pattern formation method comprises: a step a in which an active light-sensitive or radiation-sensitive resin composition is coated on a substrate to form a resist film; a step b in which an overlay film is formed on the resist film by coating a composition for forming an overlay film on the resist film; a step c in which the resist film having an overlay film formed thereon is exposed to light; and a step d in which a pattern is formed by using a developing solution, which includes an organic solvent, to develop the resist film which has been exposed to light. The receding contact angle of the water on the surface of the overlay film is 80° or more.