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1. (WO2016052253) LIQUID EJECTION DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2016/052253 International Application No.: PCT/JP2015/076653
Publication Date: 07.04.2016 International Filing Date: 18.09.2015
IPC:
B05C 5/00 (2006.01) ,B05C 11/10 (2006.01) ,B41J 2/01 (2006.01) ,B41J 2/175 (2006.01) ,H01L 21/027 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
5
Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11
Component parts, details or accessories not specifically provided for in groups B05C1/-B05C9/132
10
Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
B PERFORMING OPERATIONS; TRANSPORTING
41
PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
J
TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2
Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005
characterised by bringing liquid or particles selectively into contact with a printing material
01
Ink jet
B PERFORMING OPERATIONS; TRANSPORTING
41
PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
J
TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2
Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005
characterised by bringing liquid or particles selectively into contact with a printing material
01
Ink jet
17
characterised by ink handling
175
Ink supply systems
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
Applicants: SEKISUI CHEMICAL CO., LTD.[JP/JP]; 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5308565, JP
Inventors: UEDA, Michihisa; JP
HONDA, Masumi; JP
MORIMOTO, Naoyuki; JP
INOUE, Takanori; JP
WATANABE, Takashi; JP
HAMADA, Taichi; JP
TAKAHASHI, Ryosuke; JP
Agent: MIYAZAKI & METSUGI; Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028, JP
Priority Data:
2014-20279601.10.2014JP
2014-20358102.10.2014JP
2015-12729125.06.2015JP
2015-12822826.06.2015JP
Title (EN) LIQUID EJECTION DEVICE
(FR) DISPOSITIF D'ÉJECTION DE LIQUIDE
(JA) 液体吐出装置
Abstract:
(EN) Provided is a liquid ejection device which is capable of stably and efficiently applying a high-quality curable composition by heating the curable composition to a temperature, at which the curable composition is able to be ejected from a head, in a short time without heating the curable composition excessively rapidly. This liquid ejection device (1) is provided with: a first tank (2) for retaining a liquid composition; a head (3) for ejecting the composition; a first heating means (4) for heating the composition within the first tank (2); a first channel (5) for supplying the composition from the first tank (2) to the head (3); a second heating means (6) for heating the composition passing through the first channel (5) at a heating temperature higher than that of the first heating means (4); a second channel (7) for returning the composition from the head (3) to the first tank (2); a second pump (8) that is provided on the first channel (5); and a first pump (9) that is provided on the second channel (7). The temperature difference between the heating temperature of the second heating means (6) and the heating temperature of the first heating means (4) is 65°C or less.
(FR) L'invention concerne un dispositif d'éjection de liquide qui est capable d'appliquer de manière stable et efficace une composition durcissable de haute qualité en chauffant la composition durcissable à une température, à laquelle la composition durcissable est apte à être éjectée à partir d'une tête, en un temps court sans chauffer la composition durcissable de manière excessivement rapide. Ce dispositif d'éjection de liquide (1) est pourvu : d'un premier réservoir (2) pour retenir une composition liquide; d'une tête (3) pour éjecter la composition; d'un premier moyen de chauffage (4) pour chauffer la composition à l'intérieur du premier réservoir (2); d'un premier canal (5) pour fournir la composition à partir du premier réservoir (2) à la tête (3); d'un second moyen de chauffage (6) pour chauffer la composition passant à travers le premier canal (5) à une température de chauffage plus élevée que celle du premier moyen de chauffage (4); d'un second canal (7) pour renvoyer la composition de la tête (3) au premier réservoir (2); d'une seconde pompe (8) qui est prévue sur le premier canal (5); et d'une première pompe (9) qui est prévue sur le second canal (7). La différence de température entre la température de chauffage du second moyen de chauffage (6) et la température de chauffage du premier moyen de chauffage (4) est de 65°C ou moins.
(JA)  硬化性組成物を過度に急加熱することなくかつ短時間でヘッドから吐出可能な温度まで昇温することで、高性質な硬化性組成物を安定してかつ効率よく塗工することができる液体吐出装置を提供する。 液体吐出装置(1)は、液状の組成物を貯留する第1のタンク(2)と、組成物を吐出するヘッド(3)と、第1のタンク(2)内の組成物を加熱する第1の加熱手段(4)と、第1のタンク(2)からヘッド(3)に組成物を供給する第1の流路(5)と、第1の流路(5)内を通過する組成物を、第1の加熱手段(4)よりも高い加熱温度で加熱する第2の加熱手段(6)と、ヘッド(3)から第1のタンク(2)に組成物を還流させる第2の流路(7)と、第1の流路(5)に設けられる第2のポンプ(8)と、第2の流路(7)に設けられる第1のポンプ(9)とを備え、第2の加熱手段(6)による加熱温度と、第1の加熱手段(4)による加熱温度との温度差が65℃以下である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)