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1. (WO2016052162) COPPER FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING COPPER FILM IN WHICH SAID COMPOSITION IS USED

Pub. No.:    WO/2016/052162    International Application No.:    PCT/JP2015/076062
Publication Date: Fri Apr 08 01:59:59 CEST 2016 International Filing Date: Tue Sep 15 01:59:59 CEST 2015
IPC: C23C 18/08
Applicants: ADEKA CORPORATION
株式会社ADEKA
Inventors: ABE Tetsuji
阿部 徹司
SAITO Kazuya
斎藤 和也
FURIHATA Yasuhisa
降幡 泰久
Title: COPPER FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING COPPER FILM IN WHICH SAID COMPOSITION IS USED
Abstract:
 The present invention provides a copper film-forming composition in the form of a solution that does not contain a solid phase such as microparticles, said composition making it possible to obtain a copper film having sufficient electroconductivity by being applied onto a substrate and heated at less than 160°C. The copper film-forming composition contains 0.1-3.0 mol/kg of copper formate or a hydrate thereof, at least one compound selected from the group consisting of compounds represented by general formula (1) and compounds represented by general formula (1'), and a piperidine compound represented by general formula (2).