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1. (WO2016051899) SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2016/051899 International Application No.: PCT/JP2015/069463
Publication Date: 07.04.2016 International Filing Date: 06.07.2015
IPC:
H01L 21/677 (2006.01) ,H01L 21/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
Applicants:
株式会社SCREENホールディングス SCREEN HOLDINGS CO., LTD. [JP/JP]; 京都府京都市上京区堀川通寺之内上る4丁目天神北町1番地の1 Tenjinkita-machi 1-1, Teranouchi-agaru 4-chome, Horikawa-dori, Kamigyo-ku, Kyoto-shi, Kyoto 6028585, JP
Inventors:
橋本 光治 HASHIMOTO Koji; JP
波多野 章人 HATANO Akito; JP
Agent:
杉谷 勉 SUGITANI Tsutomu; JP
Priority Data:
2014-20102430.09.2014JP
Title (EN) SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
(FR) DISPOSITIF DE TRAITEMENT DE SUBSTRAT ET PROCÉDÉ DE TRAITEMENT DE SUBSTRAT
(JA) 基板処理装置および基板処理方法
Abstract:
(EN) In a substrate processing device of the present invention, if there is an inclination defective substrate Wf which is a substrate W that has been determined, by an inclination defect determination part, to have an inclination greater than a preset threshold value, an extraction order changing part changes the order for extracting a plurality of substrates W accommodated within a carrier C from the upper side so as to reverse the order for extracting a substrate W, between the inclination defective substrate Wf and a substrate W that is at least one level above the inclination defective substrate Wf. More specifically, the order is changed so that the inclination defective substrate Wf, the surface of which is in danger of being caught on a hand, is extracted before the substrate W that is one level above. Due to this configuration, damage to a substrate due to scratching of the substrate surface by the hand of a substrate transport mechanism can be prevented.
(FR) Dans un dispositif de traitement de substrat de la présente invention, s'il existe un substrat à inclinaison défectueuse Wf qui est un substrat W qui a été déterminé, par une partie de détermination de défaut d'inclinaison, comme ayant une inclinaison supérieure à une valeur seuil prédéfinie, une partie de changement d'ordre d'extraction modifie l'ordre d'extraction d'une pluralité de substrats W logés à l'intérieur d'un support C à partir de la face supérieure de manière à inverser l'ordre d'extraction d'un substrat W, entre le substrat à inclinaison défectueuse Wf et un substrat W qui est au moins un niveau au-dessus du substrat à inclinaison défectueuse Wf. Plus particulièrement, l'ordre est modifié de telle sorte que le substrat à inclinaison défectueuse Wf, dont la surface risque de se prendre dans une main, est extrait avant le substrat W qui est un niveau au-dessus. Grâce à cette configuration, il est possible d'empêcher les dommages causés à un substrat en raison de rayures de la surface du substrat par la main d'un mécanisme de transport de substrat.
(JA)  基板処理装置において、取り出し順番変更部は、傾き不良判定部で基板Wの傾きが予め設定された閾値よりも大きいと判定された傾き不良基板Wfが存在する場合、キャリアC内に収納された複数の基板Wを上側から取り出す順番に関して、傾き不良基板Wfとその少なくとも1段上の基板Wとの間で基板Wを取り出す順番を逆に変更する。すなわち、ハンドにより表面が引っかかれるおそれのある傾き不良基板Wfをその1段上の基板Wよりも先に取り出すように順番を変更する。これにより、基板表面を基板搬送機構のハンドにより引っかくことで、基板を破損してしまうことを防止できる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)