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Machine translation
1. (WO2016051659) POLISHING COMPOSITION AND POLISHING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/051659    International Application No.:    PCT/JP2015/004378
Publication Date: 07.04.2016 International Filing Date: 28.08.2015
IPC:
C09K 3/14 (2006.01), B24B 37/00 (2012.01), C09G 1/02 (2006.01), H01L 21/304 (2006.01)
Applicants: FUJIMI INCORPORATED [JP/JP]; 1-1, Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-shi, Aichi 4528502 (JP)
Inventors: ISHIDA, Yasuto; (TW)
Agent: MORI, Tetsuya; (JP)
Priority Data:
2014-197860 29.09.2014 JP
Title (EN) POLISHING COMPOSITION AND POLISHING METHOD
(FR) COMPOSITION DE POLISSAGE ET PROCÉDÉ DE POLISSAGE
(JA) 研磨用組成物及び研磨方法
Abstract: front page image
(EN)For the polishing of polysilicon-containing substrates, provided are a polishing composition and a polishing method capable of suppressing the rate of polishing polysilicon and selectively polishing silicon compounds other than polysilicon, particularly silicon nitride. A polishing composition containing abrasive grains, an organic acid, and a conjugate base of the organic acid is used as the polishing composition.
(FR)L'invention concerne une composition de polissage et un procédé de polissage pour le polissage de substrats contenant du silicium polycristallin, cette composition et ce procédé permettant de supprimer le taux de polissage du silicium polycristallin et de polir de manière sélective les composés de silicium autres que le silicium polycristallin, en particulier le nitrure de silicium. Une composition de polissage contenant des grains abrasifs, un acide organique et une base conjuguée de l'acide organique est utilisée comme composition de polissage.
(JA)ポリシリコンを含む基板の研磨において、ポリシリコンの研磨速度を抑制して、ポリシリコン以外のシリコン化合物等、特に、窒化シリコンを選択的に研磨することが可能な研磨用組成物及び研磨方法を提供する。研磨用組成物として、砥粒、有機酸、及び前記有機酸の共役塩基を含有する研磨用組成物を使用する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)