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1. (WO2016051454) SENSOR NODE PACKAGE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2016/051454 International Application No.: PCT/JP2014/075837
Publication Date: 07.04.2016 International Filing Date: 29.09.2014
IPC:
H05K 5/02 (2006.01) ,H01L 23/02 (2006.01) ,H01L 23/08 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5
Casings, cabinets or drawers for electric apparatus
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
06
characterised by the material of the container or its electrical properties
08
the material being an electrical insulator, e.g. glass
Applicants: NGK INSULATORS, LTD.[JP/JP]; 2-56, Suda-cho, Mizuho-ku, Nagoya-shi Aichi 4678530, JP
Inventors: YANO Shinsuke; JP
WATANABE Keiichiro; JP
Agent: YOSHITAKE Hidetoshi; 10th floor, Sumitomo-seimei OBP Plaza Bldg., 4-70, Shiromi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400001, JP
Priority Data:
Title (EN) SENSOR NODE PACKAGE
(FR) BOÎTIER DE NŒUD CAPTEUR
(JA) センサノード用パッケージ
Abstract:
(EN) [Problem] To provide a sensor node package wherein breakage of a package member and/or a cover member due to heat stress is reduced. [Solution] The present invention is capable of effectively reducing breakage of a package member and/or a cover member due to heat stress by having the Young's modulus of the package member equal to or less than 220 GPa, the thermal expansion coefficient of the package member within a range of 2-12 ppm/°C, the difference between the thermal expansion coefficient of the package member and that of the cover member equal to or less than 5 ppm/°C, and the thickness of the cover member equal to or less than 3mm.
(FR) Le problème décrit par la présente invention est de pourvoir à un boîtier de nœud capteur dans lequel la rupture d'un élément boîtier et/ou d'un élément couvercle due à une contrainte thermique est réduite. La solution de la présente invention permet de réduire efficacement la rupture d'un élément boîtier et/ou d'un élément couvercle due à une contrainte thermique par obtention d'un module de Young de l'élément boîtier égal ou inférieur à 220 GPa, d'un coefficient de dilatation thermique de l'élément boîtier compris dans une plage de 2 à 12 ppm/°C, d'une différence entre le coefficient de dilatation thermique de l'élément boîtier et celui de l'élément couvercle égale ou inférieure à 5 ppm/°C, et d'une épaisseur de l'élément couvercle égale ou inférieure à 3 mm.
(JA) 【課題】熱応力に起因するパッケージ部材及び/又は蓋部材の破損が低減されたセンサノード用パッケージを提供する。 【解決手段】パッケージ部材のヤング率(220GPa以下)、パッケージ部材の熱膨張係数(2~12ppm/℃)、パッケージ部材と蓋部材との間での熱膨張係数の差(5ppm/℃以下)、及び蓋部材の厚み(3mm以下)をそれぞれ所定の範囲内に収めることにより、熱応力に起因するパッケージ部材及び/又は蓋部材の破損を有効に低減することができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)