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1. (WO2016048347) FLEXIBLE PACKAGING ARCHITECTURE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2016/048347 International Application No.: PCT/US2014/057648
Publication Date: 31.03.2016 International Filing Date: 26.09.2014
IPC:
H01L 23/12 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors:
CHEAH, Bok Eng; MY
KONG, Jackson Chung Peng; MY
PERIAMAN, Shanggar; MY
SKINNER, Michael; US
CHEW, Yen Hsiang; MY
MAR, Kheng Tat; MY
ABD RAZAK, Ridza Effendi; MY
OOI, Kooi Chi; MY
Agent:
LINDEEN III, Gordon R.; US
Priority Data:
Title (EN) FLEXIBLE PACKAGING ARCHITECTURE
(FR) ARCHITECTURE DE CONDITIONNEMENT SOUPLE
Abstract:
(EN) A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.
(FR) La présente invention porte sur une architecture de conditionnement souple qui est appropriée pour des formes de conditionnement courbes. Selon un exemple, un conditionnement a une première puce, une première couche de composé de moule sur la première puce, une couche de câblage sur la première couche de composé de moule, une seconde puce sur la couche de câblage et couplée électriquement à la couche de câblage, et une seconde couche de composé de moule sur la seconde puce.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP3022765CN105659375KR1020160047423RU2015136239RU0002623697BR112015020625
US20170345763KR1020180008887IN201747004901