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1. WO2016021223 - IMPRINT METHOD AND IMPRINT MOLD MANUFACTURING METHOD

Publication Number WO/2016/021223
Publication Date 11.02.2016
International Application No. PCT/JP2015/057128
International Filing Date 11.03.2015
IPC
H01L 21/027 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
B29C 59/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59Surface shaping, e.g. embossing; Apparatus therefor
02by mechanical means, e.g. pressing
CPC
B29C 2035/0827
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
35Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
02Heating or curing, e.g. crosslinking or vulcanizing ; during moulding, e.g. in a mould
08by wave energy or particle radiation
0805using electromagnetic radiation
0827using UV radiation
B29C 35/0805
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
35Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
02Heating or curing, e.g. crosslinking or vulcanizing ; during moulding, e.g. in a mould
08by wave energy or particle radiation
0805using electromagnetic radiation
B29C 59/022
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59Surface shaping ; of articles; , e.g. embossing; Apparatus therefor
02by mechanical means, e.g. pressing
022characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
B29C 59/026
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59Surface shaping ; of articles; , e.g. embossing; Apparatus therefor
02by mechanical means, e.g. pressing
026of layered or coated substantially flat surfaces
G03F 7/0002
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
H01L 21/027
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Applicants
  • 大日本印刷株式会社 DAI NIPPON PRINTING CO., LTD. [JP]/[JP]
Inventors
  • 長井 隆治 Nagai Takaharu
  • 稲月 友一 Inazuki Yuichi
  • 鈴木 勝敏 Suzuki Katsutoshi
  • 引地 龍吾 Hikichi Ryugo
  • 市村 公二 Ichimura Koji
  • 原田 三郎 Harada Saburou
Agents
  • 米田 潤三 Yoneda Junzo
Priority Data
2014-16217108.08.2014JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) IMPRINT METHOD AND IMPRINT MOLD MANUFACTURING METHOD
(FR) PROCÉDÉ D'IMPRESSION ET PROCÉDÉ DE FABRICATION DE MOULE D'IMPRESSION
(JA) インプリント方法およびインプリントモールドの製造方法
Abstract
(EN)
An imprint method using a mold having a mesa structure and/or a transfer substrate includes a resin supply step, a contact step, a curing step, and a mold-removal step, wherein the resin supply step includes supplying a resin to be molded and forming a balance layer in a region outside a pattern formation region of a transfer substrate in which a pattern structure is planned to be formed.
(FR)
L'invention concerne un procédé d'impression utilisant un moule ayant une structure mesa et/ou un substrat de transfert, lequel procédé comprend une étape d'alimentation en résine, une étape de contact, une étape de durcissement, et une étape d'enlèvement de moule, laquelle étape d'alimentation en résine comprend la fourniture d'une résine à mouler et la formation d'une couche d'équilibrage dans une région à l'extérieur d'une région de formation de motif d'un substrat de transfert dans lequel il est prévu de former une structure de motif.
(JA)
 メサ構造を有するモールドおよび/または転写基板を使用するインプリント方法であり、樹脂供給工程、接触工程、硬化工程、離型工程と、を有し、樹脂供給工程では、パターン構造体を形成する予定の転写基板のパターン形成領域の外側の領域にも被成形樹脂を供給してバランス層を形成する。
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