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1. WO2015182241 - METHOD FOR SPLITTING BRITTLE SUBSTRATE

Publication Number WO/2015/182241
Publication Date 03.12.2015
International Application No. PCT/JP2015/060199
International Filing Date 31.03.2015
IPC
C03B 33/037 2006.1
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
BMANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
33Severing cooled glass
02Cutting or splitting sheet glass; Apparatus or machines therefor
023the sheet being in a horizontal position
037Controlling or regulating
B28D 5/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
5Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
CPC
B28D 1/225
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
1Working stone or stone-like materials, e.g. brick, concrete ; or glass; , not provided for elsewhere; Machines, devices, tools therefor
22by cutting, e.g. incising
225for scoring or breaking, e.g. tiles
B28D 5/00
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
5Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
B28D 5/0011
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
5Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
0005by breaking, e.g. dicing
0011with preliminary treatment, e.g. weakening by scoring
C03B 33/023
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
33Severing cooled glass
02Cutting or splitting sheet glass ; or ribbons; Apparatus or machines therefor
023the sheet ; or ribbon; being in a horizontal position
C03B 33/033
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
33Severing cooled glass
02Cutting or splitting sheet glass ; or ribbons; Apparatus or machines therefor
023the sheet ; or ribbon; being in a horizontal position
033Apparatus for opening score lines in glass sheets
C03B 33/037
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
33Severing cooled glass
02Cutting or splitting sheet glass ; or ribbons; Apparatus or machines therefor
023the sheet ; or ribbon; being in a horizontal position
037Controlling or regulating
Applicants
  • 三星ダイヤモンド工業株式会社 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. [JP]/[JP]
Inventors
  • 曽山 浩 SOYAMA Hiroshi
Agents
  • 吉竹 英俊 YOSHITAKE Hidetoshi
Priority Data
2014-11237630.05.2014JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR SPLITTING BRITTLE SUBSTRATE
(FR) PROCEDE DE DECOUPE EN TRANCHES DE SUBSTRAT FRAGILE
(JA) 脆性基板の分断方法
Abstract
(EN) Sliding motion of a cutting edge (51) is used to cause plastic deformation in a first surface (SF1) of a brittle substrate (4) and form a trench line (TL). Said trench line (TL) is formed in such a manner so as to produce a crack-free state in which, directly underneath the trench line (TL), the brittle substrate (4) is connected in a continuous fashion in a direction that intersects the trench line (TL). Said crack-free state is then maintained. Next, a crack is made to extend in the thickness direction through the brittle substrate (4) along the trench line (TL), forming a crack line (CL), and the brittle substrate (4) is split along said crack line (CL).
(FR) La présente invention concerne un procédé selon lequel mouvement de coulissement d'une arête tranchante (51) est utilisé pour entraîner une déformation plastique dans une première surface (SF1) d'un substrat fragile (4) et la formation d'une ligne de tranchée (TL). Ladite ligne de tranchée (TL) est formée de manière à produire un état exempt de fissures dans lequel, directement au-dessous de la ligne de tranchée (TL), le substrat fragile (4) est relié d'une manière continue dans une direction qui croise la ligne de tranchée (TL). Ledit état exempt de fissures est alors maintenu. Ensuite, une fissure est amenée à se prolonger dans la direction de l'épaisseur à travers le substrat fragile (4) le long de la ligne de tranchée (TL), formant une ligne de fissure (CL), et le substrat fragile (4) est découpé en tranches le long de ladite ligne de fissure (CL).
(JA)  刃先(51)を摺動させることによって脆性基板(4)の第1の面(SF1)上に塑性変形を発生させることでトレンチライン(TL)が形成される。トレンチライン(TL)の形成は、トレンチライン(TL)の直下において脆性基板(4)がトレンチライン(TL)と交差する方向において連続的につながっている状態であるクラックレス状態が得られるように行なわれる。次にクラックレス状態が維持される。次にトレンチライン(TL)に沿って厚さ方向における脆性基板(4)のクラックを伸展させることによって、クラックライン(CL)が形成される。クラックライン(CL)に沿って脆性基板(4)が分断される。
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