Processing

Please wait...

Settings

Settings

Goto Application

1. WO2015170744 - COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, AND ELECTRONIC DEVICE

Publication Number WO/2015/170744
Publication Date 12.11.2015
International Application No. PCT/JP2015/063316
International Filing Date 08.05.2015
IPC
C09K 5/14 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
08Materials not undergoing a change of physical state when used
14Solid materials, e.g. powdery or granular
C08G 59/20 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20characterised by the epoxy compounds used
CPC
C08G 59/20
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
20characterised by the epoxy compounds used
C08G 59/245
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
20characterised by the epoxy compounds used
22Di-epoxy compounds
24carbocyclic
245aromatic
C08G 59/5033
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
50Amines
5033aromatic
C08G 65/18
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
65Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
02from cyclic ethers by opening of the heterocyclic ring
04from cyclic ethers only
06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
16Cyclic ethers having four or more ring atoms
18Oxetanes
C08K 2003/385
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
38Boron-containing compounds
382and nitrogen
385Binary compounds of nitrogen with boron
C08K 3/28
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
28Nitrogen-containing compounds
Applicants
  • JNC株式会社 JNC CORPORATION [JP]/[JP]
  • 地方独立行政法人大阪市立工業研究所 OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE [JP]/[JP]
Inventors
  • 藤原 武 FUJIWARA, Takeshi
  • 稲垣 順一 INAGAKI, Jyunichi
  • 矢田 行人 YADA, Yukito
  • 岡田 哲周 OKADA, Akinori
  • 上利 泰幸 AGARI, Yasuyuki
  • 平野 寛 HIRANO, Hiroshi
  • 門多 丈治 KADOTA, Joji
Agents
  • 宮川 貞二 MIYAGAWA, Teiji
Priority Data
2014-09819009.05.2014JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, AND ELECTRONIC DEVICE
(FR) COMPOSITION POUR ÉLÉMENTS DE DISSIPATION DE CHALEUR, ÉLÉMENT DE DISSIPATION DE CHALEUR, ET DISPOSITIF ÉLECTRONIQUE
(JA) 放熱部材用組成物、放熱部材、電子機器
Abstract
(EN) The invention of the present application provides: a composition capable of forming heat-dissipation members having high thermal conductivity; and a heat-dissipation member. The composition for heat-dissipation members includes: a polymerizable liquid crystal compound which has, at both ends, a structure including an oxiranyl group or an oxetanyl group; a curing agent for curing the polymerizable liquid crystal compound; and an inorganic filler formed from a nitride. The curing temperature of the composition for heat-dissipation members is more than or within the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and less than or within the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. A heat-dissipation member formed from this composition is capable of exhibiting excellent thermal conductivity as a result of the synergistic effect of the inorganic filler formed from the nitride and the alignment of the liquid crystal compound.
(FR) L'invention selon la présente demande concerne : une composition capable de former des éléments de dissipation de chaleur ayant une conductivité thermique élevée ; et un élément de dissipation de chaleur. La composition pour éléments de dissipation de chaleur contient : un composé polymérisable de type cristal liquide portant, à ses deux extrémités, une structure comprenant un groupe oxiranyle ou un groupe oxétanyle ; un agent durcisseur pour durcir le composé polymérisable de type cristal liquide ; et une charge inorganique formée à partir d'un nitrure. La température de durcissement de la composition pour éléments de dissipation de chaleur est supérieure à, ou s'inscrit dans, une plage de températures dans laquelle le composé polymérisable présente une phase cristal liquide, et inférieure à, ou s'inscrit dans, une plage de températures dans laquelle le composé polymérisable de type cristal liquide présente une phase isotrope. Un élément de dissipation de chaleur formé à partir de cette composition est capable de manifester une excellente conductivité thermique suite à l'effet synergique de la charge inorganique formé à partir du nitrure et de l'alignement du composé de type cristal liquide.
(JA)  本願発明は、高熱伝導性を有する放熱部材を形成可能な組成物および放熱部材である。本願の放熱部材用組成物は、オキシラニル基またはオキセタニル基を含む構造を両末端に有する重合性液晶化合物と;前記重合性液晶化合物を硬化させる硬化剤と;窒化物で形成された無機フィラーとを含む。放熱部材用組成物の硬化温度は、前記重合性液晶化合物が液晶相を示す温度範囲以上、等方相を示す温度範囲以下である。このような組成物から形成された放熱部材は、液晶化合物の配向と窒化物で形成された無機フィラーとの相乗効果により、優れた熱伝導性を有することができる。
Latest bibliographic data on file with the International Bureau