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1. WO2015146394 - SPUTTERING TARGET OF SINTERED SB-TE-BASED ALLOY

Publication Number WO/2015/146394
Publication Date 01.10.2015
International Application No. PCT/JP2015/054712
International Filing Date 20.02.2015
Chapter 2 Demand Filed 07.09.2015
IPC
C23C 14/34 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
C22C 1/04 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
1Making non-ferrous alloys
04by powder metallurgy
C22C 12/00 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
12Alloys based on antimony or bismuth
C22C 28/00 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
28Alloys based on a metal not provided for in groups C22C5/-C22C27/103
C22C 32/00 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
32Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
B22F 1/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
CPC
B22F 2009/044
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
9Making metallic powder or suspensions thereof
02using physical processes
04starting from solid material, e.g. by crushing, grinding or milling
044by jet milling
B22F 2009/0848
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
9Making metallic powder or suspensions thereof
02using physical processes
06starting from liquid material
08by casting, e.g. through sieves or in water, by atomising or spraying
082atomising using a fluid
0848Melting process before atomisation
B22F 3/15
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
3Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; ; Presses and furnaces
12Both compacting and sintering
14simultaneously
15Hot isostatic pressing
B22F 9/04
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
9Making metallic powder or suspensions thereof
02using physical processes
04starting from solid material, e.g. by crushing, grinding or milling
B22F 9/082
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
9Making metallic powder or suspensions thereof
02using physical processes
06starting from liquid material
08by casting, e.g. through sieves or in water, by atomising or spraying
082atomising using a fluid
C22C 1/04
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
1Making alloys
04by powder metallurgy
Applicants
  • JX金属株式会社 JX NIPPON MINING & METALS CORPORATION [JP]/[JP]
Inventors
  • 小井土 由将 KOIDO Yoshimasa
Agents
  • 小越 勇 OGOSHI Isamu
Priority Data
2014-06196525.03.2014JP
2014-06196625.03.2014JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) SPUTTERING TARGET OF SINTERED SB-TE-BASED ALLOY
(FR) CIBLE DE PULVÉRISATION FAITE D'UN ALLIAGE FRITTÉ À BASE DE SB-TE
(JA) Sb-Te基合金焼結体スパッタリングターゲット
Abstract
(EN) A sputtering target of a sintered Sb-Te-based alloy which is a sputtering target having an Sb content of 10-60 at% and a Te content of 20-60 at%, the remainder comprising one or more elements selected from among Ag, In, and Ge and unavoidable impurities, characterized in that the oxides have an average grain diameter of 0.5 µm or smaller. The sputtering target of a sintered Sb-Te-based alloy has an improved structure so that the occurrence of arcing during sputtering is prevented and that a film to be deposited by the sputtering has improved thermal stability.
(FR) La présente invention concerne une cible de pulvérisation se composant d'un alliage fritté à base de Sb-Te qui est une cible de pulvérisation présentant une teneur en Sb allant de 10 à 60 % atomique et une teneur en Te allant de 20 à 60 % atomique, le reste comprenant un ou plusieurs éléments choisis parmi Ag, In et Ge et des impuretés inévitables, caractérisée en ce que les oxydes présentent un diamètre moyen de grain inférieur ou égal de 0,5 µm. La cible de pulvérisation se composant d'un alliage fritté à base de Sb-Te possède une structure améliorée de telle sorte que l'apparition d'un arc électrique pendant la pulvérisation est empêchée et qu'un film devant être déposé par la pulvérisation possède une stabilité thermique améliorée.
(JA) Sb含有量が10~60at%、Te含有量が20~60at%、残部がAg、In、Geから選択した一種以上の元素及び不可避的不純物からなるスパッタリングターゲットであって、酸化物の平均粒径が0.5μm以下であることを特徴とするSb-Te基合金焼結体スパッタリングターゲット。Sb-Te基合金焼結体スパッタリングターゲット組織の改善を図り、スパッタリング時にアーキングの発生を防止すると共に、スパッタリング膜の熱安定性を向上させることを目的とする。
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