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1. WO2015144443 - METHOD OF FORMING A METAL LAYER AND METHOD OF MANUFACTURING A SUBSTRATE HAVING SUCH METAL LAYER

Publication Number WO/2015/144443
Publication Date 01.10.2015
International Application No. PCT/EP2015/055201
International Filing Date 12.03.2015
Chapter 2 Demand Filed 08.01.2016
IPC
C25D 5/34 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
34Pretreatment of metallic surfaces to be electroplated
C25D 5/54 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
54Electroplating of non-metallic surfaces
H05K 3/42 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes
C25D 3/38 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3Electroplating; Baths therefor
02from solutions
38of copper
CPC
C25D 3/38
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
3Electroplating: Baths therefor
02from solutions
38of copper
C25D 5/34
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
34Pretreatment of metallic surfaces to be electroplated
C25D 5/56
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
54Electroplating of non-metallic surfaces
56of plastics
H05K 1/0296
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
H05K 2201/032
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
032Materials
H05K 2201/0329
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
032Materials
0329Intrinsically conductive polymer [ICP]; Semiconductive polymer
Applicants
  • ATOTECH DEUTSCHLAND GMBH [DE]/[DE]
Inventors
  • NISHIGAWA, Tadahiro
  • HIGUCHI, Jun
  • ISHIKAWA, Hitoshi
Agents
  • WONNEMANN, Jörg
Priority Data
2014-06046024.03.2014JP
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) METHOD OF FORMING A METAL LAYER AND METHOD OF MANUFACTURING A SUBSTRATE HAVING SUCH METAL LAYER
(FR) PROCÉDÉ DE FORMATION D'UNE COUCHE MÉTALLIQUE ET PROCÉDÉ DE FABRICATION D'UN SUBSTRAT PORTANT UNE TELLE COUCHE MÉTALLIQUE
Abstract
(EN) In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, said insulator outer surface and said copper layer outer surface are simultaneously subjected to (1) a process comprising treatment with an alkali metal hydroxide solution, (2) a process comprising treatment with an alkaline aqueous solution containing an aliphatic amine, (3) a process comprising treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt% and a pH of 8 to 1, (4) a process comprising treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polysty-renesulphonic acid, and (5) a process comprising copper electroplating, which are implemented sequentially.
(FR) Selon l'invention, dans un substrat tel qu'une carte de circuit imprimé comprenant un isolant et une couche de cuivre stratifiée sur une partie de l'isolant, la surface externe dudit isolant et la surface externe de ladite couche de cuivre sont simultanément soumises à (1) un procédé comprenant un traitement avec une solution d'hydroxyde de métal alcalin, (2) un procédé comprenant un traitement avec une solution aqueuse alcaline contenant une amine aliphatique, (3) un procédé comprenant un traitement avec une solution aqueuse alcaline ayant une concentration en permanganate de 0,3 à 3,5 % en poids et un pH de 8 à 1, (4) un procédé comprenant un traitement avec une solution aqueuse de microémulsion acide contenant un composé thiophène et un sel de métal alcalin de poly(acide styrènesulfonique) et (5) un procédé comprenant l'électrodéposition de cuivre, qui sont mis en œuvre séquentiellement.
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