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1. WO2015138905 - METHODS AND COMPOSITIONS FOR FORMING SOLDER BUMPS ON A SUBSTRATE WITH RADIATION CURABLE OR THERMAL CURABLE SOLDER FLUX

Publication Number WO/2015/138905
Publication Date 17.09.2015
International Application No. PCT/US2015/020456
International Filing Date 13.03.2015
IPC
H05K 3/34 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
B23K 1/20 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
C08K 5/09 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
04Oxygen-containing compounds
09Carboxylic acids; Metal salts thereof; Anhydrides thereof
H01L 23/00 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
CPC
B23K 1/0016
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
0008specially adapted for particular articles or work
0016Brazing of electronic components
B23K 1/008
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
008Soldering within a furnace
B23K 1/203
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
203Fluxing, i.e. applying flux onto surfaces
B23K 2101/42
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
36Electric or electronic devices
42Printed circuits
B23K 3/0623
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
0607Solder feeding devices
0623for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
B23K 35/3612
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
36Selection of non-metallic compositions, e.g. coatings, fluxes
3612with organic compounds as principal constituents
Applicants
  • INDIUM CORPORATION [US]/[US]
Inventors
  • HU, Ming
  • LEE, Ning-Cheng
Agents
  • MARINA, Jonathan, A.
Priority Data
14/657,26213.03.2015US
61/953,61114.03.2014US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) METHODS AND COMPOSITIONS FOR FORMING SOLDER BUMPS ON A SUBSTRATE WITH RADIATION CURABLE OR THERMAL CURABLE SOLDER FLUX
(FR) PROCÉDÉS ET COMPOSITIONS POUR FORMER DES BOSSES DE BRASURE SUR UN SUBSTRAT À L'AIDE D'UN FLUX DE BRASAGE DURCISSABLE PAR RAYONNEMENT OU THERMODURCISSABLE
Abstract
(EN) Methods of forming solder bumps or joints using a radiation curable, thermal curable solder flux, or dual curable solder flux are disclosed. The method includes applying a liquid solder flux 130 that is radiation curable or thermal curable to a substrate 110 such that the solder flux covers contact padsl20 on the substrate; placing solder balls 140 on the contacts pads covered with the radiation curable or thermal curable solder flux; heating the substrate to join the solder balls to the contact pads, thereby forming solder bumps or solder joints 150; and curing the liquid solder flux by applying radiation or heat to the substrate, thereby forming a solid film 160. The solder flux includes radiation curable, thermally curable, or dual curable materials that aid formation of solder bumps or joints before the solder flux is cured; and are curable to form a solid material by the application of radiation or heat.
(FR) L'invention concerne des procédés de formation de bosses ou joints de brasure à l'aide d'un flux de brasage durcissable par rayonnement ou thermodurcissable, ou d'un flux de brasage à durcissement double. Le procédé consiste à appliquer un flux de brasage liquide 130 qui est durcissable par rayonnement ou thermodurcissable sur un substrat 110 de manière que le flux de brasage couvre des plots de contact 120 sur le substrat ; à placer des billes de brasure 140 sur les plots de contact recouverts du flux de brasage durcissable par rayonnement ou thermodurcissable ; à chauffer le substrat pour joindre les billes de brasure aux plots de contact, ce qui permet de former des bosses de brasure ou des joints de brasure 150 ; et à durcir le flux de brasage liquide par application d'un rayonnement ou de chaleur au substrat, ce qui permet de former un film solide 160. Le flux de brasage comprend des matériaux durcissables par rayonnement, thermodurcissables ou à durcissement double qui contribuent à la formation de bosses ou joints de brasure avant que le flux de brasage ne soit durci ; et qui sont durcissables pour former un matériau solide par application d'un rayonnement ou de chaleur.
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