Processing

Please wait...

Settings

Settings

Goto Application

1. WO2015133735 - LIGHT-EMITTING DIODE SEALING MATERIAL AND LIGHT-EMITTING DIODE

Publication Number WO/2015/133735
Publication Date 11.09.2015
International Application No. PCT/KR2015/001141
International Filing Date 04.02.2015
IPC
H01L 33/52 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
CPC
H01L 2224/48095
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48095Kinked
H01L 2224/48471
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
484Connecting portions
4847the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
48471the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
H01L 2224/8592
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
85using a wire connector
85909Post-treatment of the connector or wire bonding area
8592Applying permanent coating, e.g. protective coating
H01L 33/501
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
501characterised by the materials, e.g. binder
H01L 33/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
56Materials, e.g. epoxy or silicone resin
Applicants
  • 코닝정밀소재 주식회사 CORNING PRECISION MATERIALS CO., LTD [KR]/[KR]
Inventors
  • 김지만 KIM, Jhee Mann
  • 이기연 LEE, Ki Yeon
  • 김보미 KIM, Bo Mi
  • 양춘봉 YANG, Choon Bong
  • 오윤석 OH, Yoon Seuk
Agents
  • 김선민 KIM, Seon-Min
Priority Data
10-2014-002486203.03.2014KR
Publication Language Korean (ko)
Filing Language Korean (KO)
Designated States
Title
(EN) LIGHT-EMITTING DIODE SEALING MATERIAL AND LIGHT-EMITTING DIODE
(FR) MATÉRIAU DE SCELLEMENT DE DIODE ÉLECTROLUMINESCENTE ET DIODE ÉLECTROLUMINESCENTE
(KO) 발광 다이오드용 밀봉재 및 발광 다이오드
Abstract
(EN) The present invention relates to a light-emitting diode sealing material and a light-emitting diode and, more particularly, to a light-emitting diode sealing material, which comprises a fluorescent substance and hermetically seals a light-emitting diode chip, and a light-emitting diode. To this end, the present invention provides a light-emitting diode sealing material for hermetically sealing a light-emitting diode chip, the light-emitting diode sealing material being characterized by comprising: a glass frit; and a fluorescent substance mixed with the glass frit.
(FR) La présente invention concerne un matériau de scellement de diode électroluminescente et une diode électroluminescente et, plus particulièrement, un matériau de scellement de diode électroluminescente qui comprend une substance fluorescente et qui scelle hermétiquement une puce de diode électroluminescente, et une diode électroluminescente. À cet effet, la présente invention concerne un matériau de scellement de diode électroluminescente servant à sceller hermétiquement une puce de diode électroluminescente, le matériau de scellement de diode électroluminescente étant caractérisé en ce qu'il comprend : une fritte de verre ; et une substance fluorescente mélangée avec la fritte de verre.
(KO) 본 발명은 발광 다이오드용 밀봉재 및 발광 다이오드에 관한 것으로서, 더욱 상세하게는 형광체를 포함하여 발광 다이오드 칩을 기밀 밀봉하는 발광 다이오드용 밀봉재 및 발광 다이오드에 관한 것이다. 이를 위해, 본 발명은 발광 다이오드 칩을 기밀 밀봉하는 발광 다이오드용 밀봉재로서, 글라스 프릿; 및 상기 글라스 프릿에 혼합되는 형광체를 포함하는 것을 특징으로 하는 발광 다이오드용 밀봉재를 제공한다.
Latest bibliographic data on file with the International Bureau