H | ELECTRICITY |
01 | BASIC ELECTRIC ELEMENTS |
L | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR |
2224 | Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00 |
01 | Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto |
26 | Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto |
28 | Structure, shape, material or disposition of the layer connectors prior to the connecting process |
29 | of an individual layer connector |
29001 | Core members of the layer connector |
29099 | Material |
29198 | with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams |
29298 | Fillers |
29299 | Base material |
293 | with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof |
29338 | the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C |
29339 | Silver [Ag] as principal constituent |