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1. (WO2015126844) MICROCAPSULES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/126844    International Application No.:    PCT/US2015/016201
Publication Date: 27.08.2015 International Filing Date: 17.02.2015
IPC:
C08L 75/00 (2006.01), C08L 79/02 (2006.01), C08G 18/58 (2006.01)
Applicants: ROHM AND HAAS COMPANY [US/US]; 100 Independence Mall West Philadelphia, PA 19106 (US).
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS [US/US]; 1901 S. First Street, Ste A, MC 685 Champaign, IL 61820 (US)
Inventors: MOORE, Jeffery, S.; (US).
LI, Jun; (US).
HUGHES, Andrew; (US)
Agent: HUSER, Kevin, J.; (US)
Priority Data:
61/941,066 18.02.2014 US
Title (EN) MICROCAPSULES
(FR) MICROCAPSULES
Abstract: front page image
(EN)Microcapsules including a shell and core structure are disclosed herein. In one aspect, the core includes at least one poly(allylamine). A process for producing such microcapsules is also disclosed herein. In another aspect, a curable epoxy resin composition includes a mixture of (a) at least one epoxy monomer compound and (b) a plurality of the disclosed microcapsules. Processes for producing the curable epoxy resin composition and a cured epoxy resin composite are also disclosed.
(FR)La présente invention concerne des microcapsules à structure noyau-enveloppe. Selon un aspect de l'invention, le noyau comprend au moins une poly(allylamine). L'invention concerne également un procédé de production de ces microcapsules. Selon un autre aspect, une composition de résine époxy durcissable comprend un mélange de (a) au moins un composé monomère époxy et (b) une pluralité de microcapsules selon l'invention. L'invention concerne encore des procédés de production de la composition de résine époxy durcissable et d'un composite à base de ladite résine époxy durcie.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)