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1. (WO2015126638) BOTTOM PACKAGE WITH METAL POST INTERCONNECTIONS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/126638    International Application No.:    PCT/US2015/014870
Publication Date: 27.08.2015 International Filing Date: 06.02.2015
Chapter 2 Demand Filed:    15.12.2015    
IPC:
H01L 21/48 (2006.01), H01L 23/498 (2006.01), H01L 25/10 (2006.01)
Applicants: QUALCOMM INCORPORATED [US/US]; ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 (US)
Inventors: GU, Shiqun; (US).
RADOJCIC, Ratibor; (US).
KIM, Dong Wook; (US)
Agent: LOZA, Julio; (US)
Priority Data:
61/941,345 18.02.2014 US
14/254,494 16.04.2014 US
Title (EN) BOTTOM PACKAGE WITH METAL POST INTERCONNECTIONS
(FR) BOÎTIER INFÉRIEUR COMPORTANT DES INTERCONNEXIONS DE PLOTS MÉTALLIQUES
Abstract: front page image
(EN)A bottom package substrate is provided that includes a plurality of metal posts that electrically couple through a die-side redistribution layer to a plurality of die interconnects. The metal posts and the die interconnects are plated onto a seed layer on the bottom package substrate.
(FR)La présente invention concerne un substrat de boîtier inférieur qui comprend une pluralité de plots métalliques qui sont reliés électriquement à une pluralité d'interconnexions de puce par l'intermédiaire d'une couche de redistribution du côté puce. Les plots métalliques et les interconnexions de puce sont plaqués sur une couche de départ sur le substrat de boîtier inférieur.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)