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1. (WO2015125855) LEAD-FREE SOLDER ALLOY, SOLDER MATERIAL, AND JOINED STRUCTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/125855 International Application No.: PCT/JP2015/054581
Publication Date: 27.08.2015 International Filing Date: 19.02.2015
IPC:
B23K 35/26 (2006.01) ,C22C 13/02 (2006.01) ,H01L 21/60 (2006.01) ,H05K 3/34 (2006.01)
Applicants: KOKI COMPANY LIMITED[JP/JP]; 32-1, Senju-asahi-cho, Adachi-ku, Tokyo 1200026, JP
Inventors: IRISAWA, Atsushi; JP
WADA, Rie; JP
Agent: FUJIMOTO, Noboru; JP
Priority Data:
2014-03323424.02.2014JP
Title (EN) LEAD-FREE SOLDER ALLOY, SOLDER MATERIAL, AND JOINED STRUCTURE
(FR) ALLIAGE DE SOUDURE SANS PLOMB, MATÉRIAU DE SOUDURE ET STRUCTURE ASSEMBLÉE
(JA) 鉛フリーはんだ合金、はんだ材料及び接合構造体
Abstract: front page image
(EN) Provided is a lead-free solder alloy or the like, which contains more than 3.0 mass % but not more than 10 mass % of Sb, with the balance consisting of Sn.
(FR) La présente invention concerne un alliage de soudure sans plomb ou similaire(s), qui contient plus de 3,0% en masse mais pas plus de 10% en masse de Sb, le reste étant composé de Sn.
(JA)  Sbを3.0質量%超10質量%以下含み、残部としてSnを含む鉛フリーはんだ合金等である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)