WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Options
Query Language
Stem
Sort by:
List Length
Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2015125777) IMAGE PICKUP APPARATUS AND IMAGE PICKUP APPARATUS MANUFACTURING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/125777 International Application No.: PCT/JP2015/054294
Publication Date: 27.08.2015 International Filing Date: 17.02.2015
IPC:
H04N 5/225 (2006.01) ,H01L 21/60 (2006.01) ,H01L 23/50 (2006.01) ,H01L 27/14 (2006.01) ,H04N 5/335 (2011.01) ,H05K 1/18 (2006.01) ,H05K 3/34 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
50
for integrated circuit devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants: OLYMPUS CORPORATION[JP/JP]; 43-2, Hatagaya 2-chome, Shibuya-ku, Tokyo 1510072, JP
Inventors: YONEYAMA Jumpei; JP
SHIMOHATA Takahiro; null
Agent: ITOH Susumu; JP
Priority Data:
2014-03308124.02.2014JP
2014-03308324.02.2014JP
Title (EN) IMAGE PICKUP APPARATUS AND IMAGE PICKUP APPARATUS MANUFACTURING METHOD
(FR) APPAREIL DE CAPTURE D'IMAGE ET PROCÉDÉ DE FABRICATION D’UN APPAREIL DE CAPTURE D'IMAGE
(JA) 撮像装置および撮像装置の製造方法
Abstract:
(EN) An image pickup apparatus (1) is provided with: an image pickup element (10) that is provided with a plurality of bumps (14) in a row on an outer circumferential section of a light receiving surface (10SA); and a flexible wiring board (20) including a plurality of inner leads (21), each of which is configured from a leading end portion (21X), a bent portion (21Y), and a rear end portion (21Z), and has the leading end portion (21X) press-bonded to each of the bumps (14), and the rear end portion (21Z) disposed in parallel to a side surface (10SS) of the image pickup element (10) with the bent portion (21Y) between the leading end portion and the rear end portion. A height (H1) of the light receiving section side (14S1) of the bumps (14) is less than a height (H2) of the side surface side (14S2), and the inner lead (21) is plastically deformed corresponding to upper surface shapes of the bumps (14).
(FR) La présente invention concerne un appareil de capture d'image (1) qui comprend : un élément de capture d'image (10) qui est pourvu d'une pluralité de bossages (14) disposés dans une rangée sur une section circonférentielle externe d'une surface de réception de lumière (10SA) ; et une carte de câblage souple (20) comprenant une pluralité de conducteurs internes (21) qui sont constitués chacun d’une partie d'extrémité avant (21X), d’une partie courbée (21Y) et d’une partie d'extrémité arrière (21Z), la partie d'extrémité avant (21X) étant liée par pression à chacun des bossages (14) tandis que la partie d'extrémité arrière (21Z) est disposée parallèlement à une surface latérale (10SS) de l'élément de capture d'image (10) avec la partie courbée (21Y) entre la partie d'extrémité avant et la partie d'extrémité arrière. Une hauteur (H1) du côté de la section de réception de lumière (14S1) des bossages (14) est inférieure à une hauteur (H2) du côté de la surface latérale (14S2), et le conducteur intérieur (21) est plastiquement déformé pour correspondre aux formes de la surface supérieure des bossages (14).
(JA) 撮像装置1は、受光面10SAの外周部に複数のバンプ14が列設されている撮像素子10と、それぞれが先端部21Xと屈曲部21Yと後端部21Zとからなり、先端部21Xがバンプ14と圧着接合されており、屈曲部21Yを介して、後端部21Zが撮像素子10の側面10SSと平行に配置されている複数のインナーリード21、を含むフレキシブル配線板20と、を具備し、バンプ14の受光部側14S1の高さH1が側面側14S2の高さH2よりも低く、インナーリード21が、バンプ14の上面形状に応じて塑性変形している。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)