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1. (WO2015125504) PATTERN-MEASURING DEVICE AND COMPUTER PROGRAM
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/125504 International Application No.: PCT/JP2015/050195
Publication Date: 27.08.2015 International Filing Date: 07.01.2015
IPC:
G01B 15/00 (2006.01) ,G01B 15/04 (2006.01)
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
15
Measuring arrangements characterised by the use of wave or particle radiation
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
15
Measuring arrangements characterised by the use of wave or particle radiation
04
for measuring contours or curvatures
Applicants:
株式会社 日立ハイテクノロジーズ HITACHI HIGH-TECHNOLOGIES CORPORATION [JP/JP]; 東京都港区西新橋一丁目24番14号 24-14, Nishi Shimbashi 1-chome, Minato-ku, Tokyo 1058717, JP
Inventors:
豊田 康隆 TOYODA Yasutaka; JP
新藤 博之 SINDO Hiroyuki; JP
Agent:
井上 学 INOUE Manabu; JP
Priority Data:
2014-03120321.02.2014JP
Title (EN) PATTERN-MEASURING DEVICE AND COMPUTER PROGRAM
(FR) DISPOSITIF DE MESURE DE MOTIF ET PROGRAMME INFORMATIQUE
(JA) パターン測定装置、及びコンピュータープログラム
Abstract:
(EN) In order to provide a pattern-measuring device and a computer program that quantitatively evaluate the effects brought about by the presence of pattern deformations in a circuit, this invention proposes a pattern-measuring device that measures first distances between first edges in pattern data being measured and second edges that correspond to said first edges in a benchmark pattern that corresponds to the pattern being measured. Said pattern-measuring device computes a score for the first edges or the pattern being measured on the basis of the first distances and second distances between the first edges and/or the second edges and third edges that are adjacent to but different from the first and second edges.
(FR) L'invention vise à procurer un dispositif de mesure de motif et un programme informatique qui évaluent de façon quantitative les effets produits par la présence de déformations de motif dans un circuit. A cet effet, l'invention porte sur un dispositif de mesure de motif, lequel dispositif mesure des premières distances entre des premiers bords dans des données de motifs qui sont mesurées et des deuxièmes bords qui correspondent auxdits premiers bords dans un motif étalon qui correspond au motif qui est mesuré. Ledit dispositif de mesure de motif calcule un score pour les premiers bords du motif qui est mesuré sur la base des premières distances et des deuxièmes distances entre les premiers bords et/ou les deuxièmes bords et des troisièmes bords qui sont adjacents aux premiers et aux deuxièmes bords, mais différents de ces derniers.
(JA)  本発明は回路上に存在するパターン変形の存在がもたらす影響を定量的に評価することパターン測定装置、及びコンピュータープログラムの提供を目的とする。上記目的を達成するために、測定対象パターンデータの第1のエッジと、当該測定対象パターンに対応する基準パターンの前記第1のエッジに対応する第2のエッジとの間の第1の間隔の寸法測定を実行するパターン測定装置であって、前記第1のエッジ及び前記第2のエッジに隣接すると共に、当該第1のエッジ及び第2のエッジとは異なる第3のエッジと、前記第1のエッジ及び第2のエッジの少なくとも一方との間の第2の間隔の寸法と、前記第1の間隔の寸法に基づいて、前記第1のエッジ或いは前記測定対象パターンのスコアを算出するパターン測定装置を提案する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)