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1. (WO2015125412) DOUBLE-HEADED WORKPIECE GRINDING METHOD

Pub. No.:    WO/2015/125412    International Application No.:    PCT/JP2015/000295
Publication Date: Fri Aug 28 01:59:59 CEST 2015 International Filing Date: Sat Jan 24 00:59:59 CET 2015
IPC: B24B 7/17
H01L 21/304
Applicants: SHIN-ETSU HANDOTAI CO.,LTD.
信越半導体株式会社
Inventors: USAMI, Yoshihiro
宇佐美 佳宏
Title: DOUBLE-HEADED WORKPIECE GRINDING METHOD
Abstract:
The present invention is a double-headed workpiece grinding method that supports a thin plate-shaped workpiece from the outside in the radial direction using a ring-shaped holder and rotates same and is for simultaneously grinding both surfaces of the ring-shaped holder-supported workpiece using a pair of grindstones. The double-headed workpiece grinding method is characterized in that both surfaces of the workpiece are ground simultaneously, setting the grindstone abrasion losses per 1 µm of workpiece grinding allowance to be 0.10 µm to 0.33 µm. Provided thereby is a double-headed workpiece grinding method capable of reducing nanotopography formed in a previous step such as a slicing step without worsening flatness during the double-headed grinding step.