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Machine translation
1. (WO2015125267) PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/125267    International Application No.:    PCT/JP2014/054115
Publication Date: 27.08.2015 International Filing Date: 21.02.2014
IPC:
H05K 3/42 (2006.01)
Applicants: MEIKO ELECTRONICS CO., LTD. [JP/JP]; 5-14-15, Ogami, Ayase-shi, Kanagawa 2521104 (JP)
Inventors: TODA, Mitsuaki; (JP).
SHIMIZU, Ryoichi; (JP).
SEKI, Yasuaki; (JP)
Agent: ARAI, Shigeto; ARAI PATENT LAW OFFICE, AZUMA Bldg. 4F., 1-7, Honcho, Naka-ku, Yokohama-shi, Kanagawa 2310005 (JP)
Priority Data:
Title (EN) PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD
(FR) CARTE DE CIRCUIT IMPRIMÉ ET SON PROCÉDÉ DE FABRICATION
(JA) プリント配線基板及びプリント配線基板の製造方法
Abstract: front page image
(EN)A printed wiring board (1) is provided with an insulating layer (2) comprising an insulating material (5) in which glass cloth (6) is embedded, conducting layers (3) placed on surfaces of the insulating layer (2), a substrate main body (4) comprising the insulating layer (2) and the conducting layers (3), and a through-hole (7) which extends through the substrate main body (4). The substrate main body (4) additionally comprises an insulating resin body (9) which does not contain the glass cloth (6), the insulating resin body (9) is disposed extending between both surfaces of the substrate main body (4), and the through-hole (7) extends through the insulating resin body (9).
(FR)La présente invention concerne une carte de circuit imprimé (1) qui est dotée d'une couche isolante (2) comprenant un matériau isolant (5) dans lequel un tissu de verre (6) est inclus, de couches conductrices (3) placées sur des surfaces de la couche isolante (2), d'un corps principal (4) de substrat comprenant la couche isolante (2) et les couches conductrices (3), ainsi que d'un trou débouchant (7) qui s'étend à travers le corps principal (4) de substrat. Le corps principal (4) de substrat comprend en outre un corps de résine isolant (9) qui ne contient pas le tissu de verre (6), le corps de résine isolant (9) est disposé étendu entre les deux surfaces du corps principal (4) de substrat et le trou débouchant (7) s'étend à travers le corps de résine isolant (9).
(JA)プリント配線基板(1)は、ガラスクロス(6)が埋設された絶縁基材(5)を含む絶縁層(2)と、該絶縁層(2)の表面に配された導電層(3)と、前記絶縁層(2)及び前記導電層(3)を含む基板本体(4)と、該基板本体(4)を貫通するスルーホール(7)とを備え、前記基板本体(4)は前記ガラスクロス(6)が非含有の絶縁樹脂体(9)をさらに含み、該絶縁樹脂体(9)は前記基板本体(4)の両面間にわたって配設されていて、前記スルーホール(7)は前記絶縁樹脂体(9)を貫通している。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)