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1. (WO2015125267) PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD

Pub. No.:    WO/2015/125267    International Application No.:    PCT/JP2014/054115
Publication Date: Fri Aug 28 01:59:59 CEST 2015 International Filing Date: Sat Feb 22 00:59:59 CET 2014
IPC: H05K 3/42
Applicants: MEIKO ELECTRONICS CO., LTD.
株式会社メイコー
Inventors: TODA, Mitsuaki
戸田 光昭
SHIMIZU, Ryoichi
清水 良一
SEKI, Yasuaki
関 保明
Title: PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD
Abstract:
A printed wiring board (1) is provided with an insulating layer (2) comprising an insulating material (5) in which glass cloth (6) is embedded, conducting layers (3) placed on surfaces of the insulating layer (2), a substrate main body (4) comprising the insulating layer (2) and the conducting layers (3), and a through-hole (7) which extends through the substrate main body (4). The substrate main body (4) additionally comprises an insulating resin body (9) which does not contain the glass cloth (6), the insulating resin body (9) is disposed extending between both surfaces of the substrate main body (4), and the through-hole (7) extends through the insulating resin body (9).