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1. (WO2015123467) WAFER AND LOT BASED HIERARCHICAL METHOD COMBINING CUSTOMIZED METRICS WITH A GLOBAL CLASSIFICATION METHODOLOGY TO MONITOR PROCESS TOOL CONDITION AT EXTREMELY HIGH THROUGHPUT

Pub. No.:    WO/2015/123467    International Application No.:    PCT/US2015/015709
Publication Date: Fri Aug 21 01:59:59 CEST 2015 International Filing Date: Fri Feb 13 00:59:59 CET 2015
IPC: H01L 21/66
Applicants: KLA-TENCOR CORPORATION
Inventors: VAJARIA, Himanshu
TORELLI, Tommaso
RIES, Bradley
MAHADEVAN, Mohan
Title: WAFER AND LOT BASED HIERARCHICAL METHOD COMBINING CUSTOMIZED METRICS WITH A GLOBAL CLASSIFICATION METHODOLOGY TO MONITOR PROCESS TOOL CONDITION AT EXTREMELY HIGH THROUGHPUT
Abstract:
Methods and systems for monitoring process tool conditions are disclosed. The method combines single wafer, multiple wafers within a single lot and multiple lot information together statistically as input to a custom classification engine that can consume single or multiple scan, channel, wafer and lot to determine process tool status.