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1. (WO2015123233) HEATED PLATEN WITH IMPROVED TEMPERATURE UNIFORMITY

Pub. No.:    WO/2015/123233    International Application No.:    PCT/US2015/015310
Publication Date: Fri Aug 21 01:59:59 CEST 2015 International Filing Date: Thu Feb 12 00:59:59 CET 2015
IPC: H01L 21/265
H01J 37/317
Applicants: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
Inventors: FISH, Roger B.
ANELLA, Steven
Title: HEATED PLATEN WITH IMPROVED TEMPERATURE UNIFORMITY
Abstract:
A heated platen with improved temperature uniformity is generally described. Various examples provide a platen portion with a metallization layer thermally coupled thereto. An electrical contact may be connected to the metallization layer and configured to conduct an electric current for heating the metallization layer and the platen portion. The electrical contact may include an electrical conductor and a resistive heating element that is configured to heat up when electric current flows therethrough, thereby creating a thermal block that reduces an amount of heat that is absorbed into the electrical contact from the platen portion.