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1. (WO2015123057) APPARATUS AND METHOD FOR MEASUREMENT OF THE THERMAL PERFORMANCE OF AN ELECTROSTATIC WAFER CHUCK

Pub. No.:    WO/2015/123057    International Application No.:    PCT/US2015/014315
Publication Date: Aug 20, 2015 International Filing Date: Feb 3, 2015
IPC: H01L 21/683
H01L 21/324
Applicants: APPLIED MATERIALS, INC.
Inventors: BUSCHE, Matthew J.
PARKHE, Vijay D.
RICE, Michael R.
Title: APPARATUS AND METHOD FOR MEASUREMENT OF THE THERMAL PERFORMANCE OF AN ELECTROSTATIC WAFER CHUCK
Abstract:
An apparatus and method are described for measuring the thermal performance of a wafer chuck, such as an electrostatic chuck. In one example, the apparatus ha a chamber, a base to support a wafer chuck in the chamber, a heater to heat the chuck, a window through the exterior of the chamber, and an infrared imaging system to measure the temperature of the chuck while the chuck is heated.