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1. (WO2015122882) FORMING A CASING OF AN ELECTRONICS DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/122882    International Application No.:    PCT/US2014/015993
Publication Date: 20.08.2015 International Filing Date: 12.02.2014
IPC:
B23K 20/02 (2006.01), B23K 20/16 (2006.01), B21D 22/04 (2006.01), B21D 37/16 (2006.01)
Applicants: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. [US/US]; 11445 Compaq Center Drive W. Houston, Texas 77070 (US)
Inventors: WU, Kuan-Ting; (TW).
KANG, Yu-Chuan; (TW)
Agent: HABLINSKI, Reed, Joseph; Hewlett-Packard Company Intellectual Property Administration 3404 E. Harmony Road Mail Stop 35 Fort Collins, Colorado 80528 (US)
Priority Data:
Title (EN) FORMING A CASING OF AN ELECTRONICS DEVICE
(FR) FORMATION D'UN BOÎTIER D'UN DISPOSITIF ÉLECTRONIQUE
Abstract: front page image
(EN)A method of forming a casing of an electronic device is described in which heat and pressure are applied to a metal substrate and a metal layer in a molding device. The metal substrate and the metal layer are molded into a shape of the casing. At the same time, an intermediate phase between the metal substrate and the metal layer is formed by inter-diffusion bonding.
(FR)L'invention concerne un procédé de formation d'un boîtier d'un dispositif électronique dans lequel une chaleur et une pression sont appliquées à un substrat métallique et à une couche métallique dans un dispositif de moulage. Le substrat métallique et la couche métallique sont moulés sous la forme du boîtier. Dans le même temps, une phase intermédiaire entre le substrat métallique et la couche métallique est formée par inter-liaison par diffusion.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)