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1. (WO2015122251) COPPER POWDER

Pub. No.:    WO/2015/122251    International Application No.:    PCT/JP2015/051512
Publication Date: Fri Aug 21 01:59:59 CEST 2015 International Filing Date: Thu Jan 22 00:59:59 CET 2015
IPC: B22F 1/00
H01B 5/00
Applicants: MITSUI MINING & SMELTING CO.,LTD.
三井金属鉱業株式会社
Inventors: OTA, Koyu
織田 晃祐
SYOUJIGUCHI, Takashi
障子口 隆
Title: COPPER POWDER
Abstract:
The purpose of the present invention is to provide a novel copper powder for which powder compacting resistance is low and which is capable of maintaining excellent electrical conductivity even if the power is a microparticulate copper powder. The present invention is a copper powder characterized in that the volume cumulative particle diameter D50 measured using a laser diffraction scattering particle size distribution-measuring device is 0.20 µm - 0.70 µm and the ratio of crystallite diameter with respect to said D50 (crystallite diameter/D50) is 0.15 - 0.60 (µm/ µm).