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1. (WO2015122203) PRINTED CIRCUIT BOARD

Pub. No.:    WO/2015/122203    International Application No.:    PCT/JP2015/050041
Publication Date: Fri Aug 21 01:59:59 CEST 2015 International Filing Date: Tue Jan 06 00:59:59 CET 2015
IPC: H05K 1/02
H01Q 15/14
H05K 9/00
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: ISHIWATA, Yu
石渡 祐
AZUMA, Takahiro
東 貴博
Title: PRINTED CIRCUIT BOARD
Abstract:
A ground conductor film (11) is formed on an insulated substrate (10). A floating conductor film (12) capacitively couples to the ground conductor film (11). A radiation element (17) is connected to the floating conductor film (12). A shielding film (14) screens electromagnetic waves from the radiation element (17). Noise can be reduced by using this kind of configuration in a printed circuit board.