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Machine translation
1. (WO2015122203) PRINTED CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/122203    International Application No.:    PCT/JP2015/050041
Publication Date: 20.08.2015 International Filing Date: 05.01.2015
IPC:
H05K 1/02 (2006.01), H01Q 15/14 (2006.01), H05K 9/00 (2006.01)
Applicants: MURATA MANUFACTURING CO., LTD. [JP/JP]; 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555 (JP)
Inventors: ISHIWATA, Yu; (JP).
AZUMA, Takahiro; (JP)
Agent: KITAYAMA, Mikio; (JP)
Priority Data:
2014-024130 12.02.2014 JP
Title (EN) PRINTED CIRCUIT BOARD
(FR) CARTE DE CIRCUIT IMPRIMÉ
(JA) プリント基板
Abstract: front page image
(EN)A ground conductor film (11) is formed on an insulated substrate (10). A floating conductor film (12) capacitively couples to the ground conductor film (11). A radiation element (17) is connected to the floating conductor film (12). A shielding film (14) screens electromagnetic waves from the radiation element (17). Noise can be reduced by using this kind of configuration in a printed circuit board.
(FR)Un film conducteur de terre (11) est formé sur un substrat isolé (10). Un film conducteur flottant (12) est couplé de façon capacitive au film conducteur de terre (11). Un élément rayonnant (17) est relié au film conducteur flottant (12). Un film de blindage (14) filtre les ondes électromagnétiques provenant de l'élément rayonnant (17). Le bruit peut être réduit au moyen de ce type de configuration dans une carte de circuit imprimé.
(JA) 絶縁性基板(10)にグランド導体膜(11)が形成されている。浮遊導体膜(12)がグランド導体膜(11)と容量結合する。放射素子(17)が浮遊導体膜(12)に接続されている。遮蔽膜(14)が、放射素子(17)から放射される電磁波を遮蔽する。プリント基板にこのような構成を採用することにより、ノイズの低減を図ることが可能である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)