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1. (WO2015122114) DIE-ATTACH PASTE FOR SEMICONDUCTORS AND SEMICONDUCTOR PACKAGE

Pub. No.:    WO/2015/122114    International Application No.:    PCT/JP2015/000117
Publication Date: Fri Aug 21 01:59:59 CEST 2015 International Filing Date: Wed Jan 14 00:59:59 CET 2015
IPC: H01L 21/52
C08G 59/42
Applicants: SHOWA DENKO K.K.
昭和電工株式会社
Inventors: KOUKA, Hiroto
江夏 寛人
OZAWA, Yui
小澤 ゆい
Title: DIE-ATTACH PASTE FOR SEMICONDUCTORS AND SEMICONDUCTOR PACKAGE
Abstract:
Provided are a die-attach paste for semiconductors and a semiconductor package, whereby a semiconductor package can be produced that maintains coating properties, is capable of suppressing bleeding after coating by B-staging, is capable of obtaining sufficient adhesiveness even without heating during die-bonding, and has high reliability. The die-attach paste for semiconductors includes: a (meth) acryloyl group-containing compound (1); a ring structure-containing compound (2) containing an oxirane ring structure or an oxetane ring structure; a maleic anhydride-modified polyolefin (3); and a photopolymerizable initiator (4). Furthermore, a highly reliable, highly integrated semiconductor package can be produced by coating this semiconductor die-attach paste on to a support member or a die, then B-staging by ultraviolet irradiation, then die-bonding.