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1. (WO2015121532) A CIRCUIT BOARD AND ASSOCIATED APPARATUS AND METHODS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/121532    International Application No.:    PCT/FI2015/050058
Publication Date: 20.08.2015 International Filing Date: 30.01.2015
IPC:
H05K 1/14 (2006.01), H05K 3/36 (2006.01), H05K 1/18 (2006.01)
Applicants: NOKIA CORPORATION [FI/FI]; Karakaari 7 FI-02610 Espoo (FI)
Inventors: HAQUE, Samiul; (GB).
WHITE, Richard; (GB).
KIVIOJA, Jani; (GB)
Agent: NOKIA TECHNOLOGIES OY; Ari Aarnio IPR Department Karakaari 7 FI-02610 Espoo (FI)
Priority Data:
1402589.4 14.02.2014 GB
Title (EN) A CIRCUIT BOARD AND ASSOCIATED APPARATUS AND METHODS
(FR) CARTE DE CIRCUIT IMPRIMÉ ET APPAREIL ET PROCÉDÉS ASSOCIÉS
Abstract: front page image
(EN)A circuit board comprising a primary substrate and a secondary substrate, the primary substrate comprising a recess configured to receive the secondary substrate, and a conducting trace which extends towards an edge of the recess, the secondary substrate comprising an electronic component and a conducting trace which extends from the electronic component towards an edge of the secondary substrate, wherein the secondary substrate is positioned within the recess and attached to the primary substrate, and the conducting trace of the secondary substrate is joined to the conducting trace of the primary substrate to form an electrical connection between the electronic component and the primary substrate.
(FR)L'invention concerne une carte de circuit imprimé comprenant un substrat primaire et un substrat secondaire, le substrat primaire comprenant un évidement conçu pour recevoir le substrat secondaire, et une trace conductrice qui s'étend vers un bord de l'évidement, le substrat secondaire comprenant un composant électronique et une trace conductrice qui s'étend depuis le composant électronique vers un bord du substrat secondaire, lequel substrat secondaire est positionné à l'intérieur de l'évidement et fixé au substrat primaire, et laquelle trace conductrice du substrat secondaire est reliée à la trace conductrice du substrat primaire pour former une connexion électrique entre le composant électronique et le substrat primaire.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)