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1. (WO2015120939) METHOD FOR PRODUCING A SEALED MICROMECHANICAL COMPONENT
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/120939 International Application No.: PCT/EP2014/078998
Publication Date: 20.08.2015 International Filing Date: 22.12.2014
IPC:
B81C 1/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
1
Manufacture or treatment of devices or systems in or on a substrate
Applicants:
ROBERT BOSCH GMBH [DE/DE]; Postfach 30 02 20 70442 Stuttgart, DE
Inventors:
GONSKA, Julian; DE
REINMUTH, Jochen; DE
AMETOWOBLA, Mawuli; DE
Priority Data:
10 2014 202 801.917.02.2014DE
Title (EN) METHOD FOR PRODUCING A SEALED MICROMECHANICAL COMPONENT
(FR) PROCÉDÉ DE FABRICATION D'UN COMPOSANT MICROMÉCANIQUE SCELLÉ
(DE) VERFAHREN ZUM HERSTELLEN EINES VERSIEGELTEN MIKROMECHANISCHEN BAUELEMENTS
Abstract:
(EN) Disclosed is a method for producing a micromechanical component (100), involving the steps of: - forming an access opening (7) in a MEMS element (5) or in a cap element (6) of the component (100); - joining the MEMS element (5) to the cap element (6) such that at least one cavern (8a, 8b) is formed between the MEMS element (5) and the cap element (6); and - closing the access opening (7) to the at least one cavern (8a, 8b) under a defined atmosphere by means of a laser (9).
(FR) L'invention concerne un procédé de fabrication d'un composant micromécanique (100) qui comporte les étapes suivantes : - formation d'une ouverture d'accès (7) dans un élément MEMS (5) ou dans un élément chapeau (6) du composant (100) ; - assemblage de l'élément MEMS (5) à l'élément chapeau (6), avec formation d'au moins une caverne (8a, 8b) entre l'élément MEMS et l'élément chapeau (6) ; et - fermeture de l'ouverture d'accès (7) à la ou aux cavernes (8a, 8b) sous une atmosphère définie au moyen d'un laser (9).
(DE) Verfahren zum Herstellen eines mikromechanischen Bauelements (100), aufweisend die Schritte: - Ausbilden einer Zugangsöffnung (7) in einem MEMS-Element (5) oder in einem Kappenelement (6) des Bauelements (100); - Verbinden des MEMS-Elements (5) mit dem Kappenelement (6), wobei zwischen dem MEMS-Element (5) und dem Kappenelement (6) wenigstens eine Kaverne (8a, 8b) ausgebildet wird; und - Verschließen der Zugangsöffnung (7) zur wenigstens einen Kaverne (8a, 8b) unter einer definierten Atmosphäre mittels eines Lasers (9).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)