Search International and National Patent Collections


Pub. No.:    WO/2015/120754    International Application No.:    PCT/CN2015/070138
Publication Date: Fri Aug 21 01:59:59 CEST 2015 International Filing Date: Wed Jan 07 00:59:59 CET 2015
IPC: B29C 33/02
B29C 33/08
B29C 43/52
H05B 3/08
Applicants: LIU, Chung-nan
Inventors: LIU, Chung-nan
A mould with a heating device is disclosed. The mould mainly comprises an upper mould, a lower mould, a conductive layer, an insulating layer, at least a pair of electrodes capable of being arranged in the conductive layer in a conductive manner, at least one first conductive unit and at least one second conductive unit. As a first outer conductive section of each first conductive unit and a second outer conductive section of each second conductive unit can penetrate through a conductive side surface of the conductive layer and are located on a same side surface of the conductive layer, the first conductive unit is provided with a first inner conductive section corresponding to a cavity of the lower mould, the second conductive unit is closer to the insulating surface of the conductive layer compared with the first conductive unit, a current path flowing through the conductive layer can be controlled by means of configuration of the first and second conductive units, so that the current is relatively gathered on the surface of the conductive layer in a centralized manner, particularly gathered in the cavity in the centralized manner. Therefore, the cavity is preheated from room temperature to working temperature, and the purpose of enhancing the heating effect of a die cavity heating area is realized.