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1. (WO2015120650) HALOGEN-FREE RESIN COMPOSITION AND USES THEREOF

Pub. No.:    WO/2015/120650    International Application No.:    PCT/CN2014/073834
Publication Date: Fri Aug 21 01:59:59 CEST 2015 International Filing Date: Sat Mar 22 00:59:59 CET 2014
IPC: C08L 79/04
C08L 25/10
C08L 85/02
C08K 7/18
C08K 3/36
B32B 27/04
B32B 27/28
B32B 15/08
B32B 15/20
Applicants: SHENGYI TECHNOLOGY CO., LTD.
广东生益科技股份有限公司
Inventors: YANG, Hu
杨虎
HE, Yueshan
何岳山
Title: HALOGEN-FREE RESIN COMPOSITION AND USES THEREOF
Abstract:
Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight: (A) 40 to 80 parts of allyl modified polybenzoxazine resin; (B) 10 to 20 parts of hydrcarbon resin; (C) 10 to 40 parts of allyl modified polyphenylene ether resin; (D) 0.01 to 3 parts of initiating agent; (E) 10 to 100 parts of a filling material; and (F) 0 to 80 parts of phosphoric fire retardant. The prepreg and the laminate prepared by using the halogen-free resin composition has a low dielectric coefficient and a low dielectric loss dissipation tangent, a higher separation strength, a high glass-transition temperature, excellent heat resistance, and good flame retardation effect.