WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2015120582) PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/120582    International Application No.:    PCT/CN2014/071986
Publication Date: 20.08.2015 International Filing Date: 12.02.2014
IPC:
H05K 3/30 (2006.01), H05K 7/20 (2006.01)
Applicants: HUAWEI DEVICE CO., LTD. [CN/CN]; Building B2 Huawei Industrial Base Bantian, Longgang District Shenzhen, Guangdong 518129 (CN)
Inventors: LI, Jun; (CN).
WEI, Konggang; (CN)
Agent: LONGSUN LEAD IP LTD.; Rm 1108,11th Floor, Block C, Haixing Building, 16 Danling Street, Haidian District Beijing 100080 (CN)
Priority Data:
Title (EN) PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
(FR) CARTE DE CIRCUIT IMPRIMÉ ET PROCÉDÉ DE FABRICATION D'UNE CARTE DE CIRCUIT IMPRIMÉ
(ZH) 印制电路板和制造印制电路板的方法
Abstract: front page image
(EN)A printed circuit board and a method for manufacturing a printed circuit board. The printed circuit board comprises: a first plane, being provided with a groove, the groove being filled with tin; a second plane corresponding to the first plane, the second plane being provided with an electronic component. A manufacturing process is simplified by the groove being provided on the printed circuit board and the groove being filled with tin. It is not necessary to occupy extra space in the thickness direction, thereby enabling the printed circuit board to have a better heat dissipation effect. The temperature of the electronic component is lowered and the power consumption of an electronic device is decreased.
(FR)L'invention concerne une carte de circuit imprimé et un procédé de fabrication d'une carte de circuit imprimé. La carte de circuit imprimé comprend : un premier plan, étant pourvu d'une rainure, la rainure étant remplie d'étain; un second plan correspondant au premier plan, le second plan étant pourvu d'un composant électronique. Un processus de fabrication est simplifié par la rainure étant disposée sur la carte de circuit imprimé et la rainure étant remplie avec de l'étain. Il n'est pas nécessaire d'occuper un espace supplémentaire dans le sens de l'épaisseur, ce qui permet à la carte de circuit imprimé d'avoir un meilleur effet de dissipation thermique. La température du composant électronique est abaissée et la consommation d'énergie d'un dispositif électronique est diminuée.
(ZH)一种印制电路板和制造印制电路板的方法,该印制电路板包括:第一平面,该第一平面设置有槽,槽内填充有锡;和与第一平面所对的第二平面,该第二平面安装有电子元器件。通过在印制电路板上设置槽并在槽内填充锡,制造工艺简单,不需在厚度方向占用额外的空间,使得印制电路板具有更好的散热效果,可以降低电子元器件的温度和电子设备的功耗。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)