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1. (WO2015120383) PROCESS FOR FORMING ULTRA-MICRO LEDS AND ILLUMINATION STRUCTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/120383 International Application No.: PCT/US2015/015018
Publication Date: 13.08.2015 International Filing Date: 09.02.2015
IPC:
H01L 25/075 (2006.01) ,H01L 33/62 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
Applicants: NTHDEGREE TECHNOLOGIES WORLDWIDE INC.[US/US]; 1320 W. Auto Drive Tempe, Arizona 85284-1025, US
Inventors: RAY, William Johnstone; US
LOWENTHAL, Mark David; US
ZHENG, Lixin; US
Agent: OGONOWSKY, Brian D.; US
Priority Data:
14/616,34706.02.2015US
61/938,07910.02.2014US
Title (EN) PROCESS FOR FORMING ULTRA-MICRO LEDS AND ILLUMINATION STRUCTURE
(FR) PROCÉDÉ PERMETTANT DE FORMER DES DIODES ÉLECTROLUMINESCENTES ULTRA PETITES ET STRUCTURE D'ÉCLAIRAGE
Abstract:
(EN) A flexible light sheet includes a bottom conductor layer overlying a flexible substrate. An array of vertical light emitting diodes (VLEDs) is printed as an ink over the bottom conductor layer so that bottom electrodes of the VLEDs electrically contact the bottom conductor layer. A top electrode of the VLEDs is formed of a first transparent conductor layer, and a temporary hydrophobic layer is formed over the first transparent conductor layer. A dielectric material is deposited between the VLEDs but is automatically de-wetted off the hydrophobic layer. The hydrophobic layer is then removed, and a second transparent conductor layer is deposited to electrically contact the top electrode of the VLEDs. The VLEDs can be made less than 10 microns in diameter since no top metal bump electrode is used. The VLEDs are illuminated by a voltage differential between the bottom conductor layer and the second transparent conductor layer.
(FR) L'invention concerne une feuille de lumière flexible qui comprend une couche conductrice inférieure qui recouvre un substrat flexible. Un réseau de diodes électroluminescentes verticales (VLED pour Vertical Light Emitting Diode) est imprimé sous la forme d'une encre sur la couche conductrice inférieure de telle sorte que les électrodes inférieures des diodes VLED établissent un contact électrique avec la couche conductrice inférieure. Une électrode supérieure des diodes VLED est composée d'une première couche conductrice transparente et une couche hydrophobe temporaire est formée sur la première couche conductrice transparente. Un matériau diélectrique est déposé entre les diodes VLED mais est automatiquement déshumidifié de la couche hydrophobe. La couche hydrophobe est ensuite retirée et une seconde couche conductrice transparente est déposée de façon à établir un contact électrique avec l'électrode supérieure des diodes VLED. Les diodes VLED peuvent présenter un diamètre inférieur à 10 microns puisqu'aucune électrode supérieure à bosse métallique n'est utilisée. Les diodes VLED sont éclairées par un différentiel de tension entre la couche conductrice inférieure et la seconde couche conductrice transparente.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)