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Machine translation
1. (WO2015119399) STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/119399    International Application No.:    PCT/KR2015/000933
Publication Date: 13.08.2015 International Filing Date: 28.01.2015
IPC:
H01Q 7/00 (2006.01), H01Q 1/38 (2006.01), H01Q 1/24 (2006.01)
Applicants: EMW CO., LTD [KR/KR]; 155, Namdongseo-ro Namdong-gu Incheon 405-819 (KR)
Inventors: SEONG, Won Mo; (KR).
LEE, Won No; (KR)
Priority Data:
10-2014-0012692 04.02.2014 KR
Title (EN) STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME
(FR) STRUCTURE EMPILÉE ET MÉTHODE DE FABRICATION DE CELLE-CI
(KO) 적층형 구조체 및 그 제조 방법
Abstract: front page image
(EN)Disclosed are a stacked structure and a method of manufacturing same. A stacked structure according to an embodiment of the present invention may comprise: a pattern assembly including a laminated metal pattern having a plurality of contact portions, and configured of a film for concealing the metal pattern; and a ductile printed circuit board including a plurality of external terminals connected to the outside and a plurality of contact terminals connected to each of the plurality of external terminals, and having one surface thereof laminated on the pattern assembly so as to connect the plurality of contact terminals to the plurality of contact portions.
(FR)L'invention concerne une structure empilée et une méthode de fabrication de celle-ci. Une structure empilée selon un mode de réalisation de la présente invention peut comprendre : un ensemble motif comprenant un motif de métal stratifié ayant une pluralité de parties de contact, et constitué d'un film permettant de cacher le motif de métal; et une carte de circuits imprimés ductile comprenant une pluralité de bornes externes connectées à l'extérieur et une pluralité de bornes de contact connectées à chaque borne de la pluralité de bornes externes, et ayant une de ses surfaces stratifiée sur l'ensemble motif de façon à connecter la pluralité de bornes de contact à la pluralité de parties de contact.
(KO)적층형 구조체 및 그 제조 방법이 개시된다. 본 발명의 실시예에 따른 적층형 구조체는 복수의 접점부를 구비하는 금속 패턴이 합지되어 있으며, 상기 금속 패턴을 은폐시키기 위한 필름으로 구성된 패턴 조립체; 및 외부와 연결되는 복수의 외부 단자 및 상기 복수의 외부 단자 각각에 연결되는 복수의 접점 단자를 구비하며, 상기 복수의 접점 단자와 상기 복수의 접점부를 연결되도록 일면이 상기 패턴 조립체에 합지되는 연성인쇄회로기판을 포함할 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)