Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2015119275) METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND WIRE BONDING DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/119275 International Application No.: PCT/JP2015/053535
Publication Date: 13.08.2015 International Filing Date: 09.02.2015
IPC:
H01L 21/60 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
株式会社新川 SHINKAWA LTD. [JP/JP]; 東京都武蔵村山市伊奈平2丁目51番地の1 51-1, Inadaira 2-chome, Musashimurayama-shi, Tokyo 2088585, JP
Inventors:
関根 直希 SEKINE Naoki; JP
中澤 基樹 NAKAZAWA Motoki; JP
Priority Data:
2014-02342110.02.2014JP
Title (EN) METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND WIRE BONDING DEVICE
(FR) PROCÉDÉ DE PRODUCTION DE DISPOSITIF SEMI-CONDUCTEUR, ET DISPOSITIF DE SOUDAGE DE CÂBLE
(JA) 半導体装置の製造方法及びワイヤボンディング装置
Abstract:
(EN) This method for producing a semiconductor device includes: a wire tail formation step for forming a wire tail (43) at the tip of a bonding tool (40) by severing a portion of a wire (42) extending from the tip of the bonding tool (40) after forming a wire loop (130) between a first bonding point and second bonding point by means of the bonding tool (40); and a wire tail bending step for bending-processing the wire tail (43) in a manner such that the tip (43a) of the wire tail (43) faces upwards by means of lowering the bonding tool (40) towards the second bonding point at which the wire loop (130) is formed, and pressing the wire tail (43) against a portion of the wire loop (130) above the second bonding point. As a result, the bending-processing of the wire tail can be performed easily and efficiently.
(FR) La présente invention concerne un procédé de production d'un dispositif semi-conducteur qui consiste : en une étape de formation de queue de câble permettant de former une queue de câble (43) à la pointe d'un outil de soudage (40) en coupant une partie d'un câble (42) s'étendant depuis la pointe de l'outil de soudage (40) après avoir formé une boucle de câble (130) entre un premier point de soudage et un second point de soudage au moyen de l'outil de soudage (40) ; et une étape de courbure de queue de câble permettant de traiter par courbure la queue de câble (43) de telle manière que la pointe (43a) de la queue de câble (43) soit tournée vers le haut en abaissant l'outil de soudage (40) vers le second point de soudage auquel la boucle de câble (130) est formée, et en pressant la queue de câble (43) contre une partie de la boucle de câble (130) au-dessus du second point de soudage. En conséquence, le traitement par courbure de la queue de câble peut être effectué facilement et efficacement.
(JA)  半導体装置の製造方法は、ボンディングツール40によって第1ボンド点と第2ボンド点との間にワイヤループ130を形成した後に、ボンディングツール40の先端から延出したワイヤ42の一部を切断して、ボンディングツール40の先端にワイヤテール43を形成するワイヤテール形成工程と、ボンディングツール40をワイヤループ130が形成された第2ボンド点に向かって下降させ、ワイヤテール43を第2ボンド点上のワイヤループ130の一部に押し当てることによって、ワイヤテール43の先端43aが上方を向くようにワイヤテール43を曲げ加工するワイヤテール曲げ工程とを含む。これにより、簡便かつ効率的にワイヤテールの曲げ加工を行うことである。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)