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1. (WO2015116679) POST CHEMICAL MECHANICAL POLISHING FORMULATIONS AND METHOD OF USE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/116679    International Application No.:    PCT/US2015/013286
Publication Date: 06.08.2015 International Filing Date: 28.01.2015
IPC:
H01L 21/304 (2006.01)
Applicants: ADVANCED TECHNOLOGY MATERIALS, INC. [US/US]; 7 Commerce Drive Danbury, Connecticut 06810 (US)
Inventors: LIU, Jun; (US).
BARNES, Jeffrey A.; (US).
ZHANG, Peng; (US).
SUN, Laisheng; (US).
MEDD, Steven; (US)
Agent: FUIERER, Tristan; (US)
Priority Data:
61/933,010 29.01.2014 US
Title (EN) POST CHEMICAL MECHANICAL POLISHING FORMULATIONS AND METHOD OF USE
(FR) FORMULATIONS DESTINÉES AU POST-POLISSAGE MÉCANO-CHIMIQUE ET PROCÉDÉ D'UTILISATION
Abstract: front page image
(EN)A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of amines and ammonium-containing salts. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
(FR)L'invention concerne une composition de nettoyage et un procédé de nettoyage de résidus et contaminants situés sur un dispositif micro-électronique suite à un post-polissage mécano-chimique (CMP). Les compositions de nettoyage sont sensiblement exemptes d'amines et de sels contenant de l'ammonium. La composition permet d'effectuer un nettoyage hautement efficace des matières résiduelles et contaminantes post-CMP de la surface du dispositif micro-électronique sans nuire au matériau diélectrique à faible permittivité ni au matériau d'interconnexion en cuivre.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)