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1. (WO2015116299) HIGH RELIABILITY INTERCONNECT FOR CONDUCTIVE INK CIRCUITS

Pub. No.:    WO/2015/116299    International Application No.:    PCT/US2014/065466
Publication Date: Fri Aug 07 01:59:59 CEST 2015 International Filing Date: Fri Nov 14 00:59:59 CET 2014
IPC: H01R 12/71
Applicants: MIRACO, INC.
Inventors: BULMER, Douglas
ROBERTS, Jonathan
Title: HIGH RELIABILITY INTERCONNECT FOR CONDUCTIVE INK CIRCUITS
Abstract:
The system and method of electrically interconnecting conductive ink circuits with other electrical components such as wire harnesses, circuit boards, and flexible printed circuits. The rolling contact system does not damage or degrade the conductive ink surface, which snakes it suitable for a high number of insertion/extraction cycles. The system and method features a spring-loaded contact system that is specifically designed for a high number of mating cycles that incorporates one or more rolling conductive elements used to electrically contact a multi-conductor circuit.