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Machine translation
1. (WO2015116090) THERMAL RELIEF PAD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/116090    International Application No.:    PCT/US2014/013785
Publication Date: 06.08.2015 International Filing Date: 30.01.2014
IPC:
H05K 1/02 (2006.01), H05K 1/16 (2006.01)
Applicants: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP [US/US]; 11445 Compaq Center Drive West Houston, TX 77070 (US)
Inventors: KAPOOR, Mark, Vinod; (US).
ENGLER, David, W.; (US)
Agent: JAKOBSEN, Kraig, A.; Hewlett Packard Enterprise 3404 E. Harmony Road Mail Stop 79 Fort Collins, CO 80528 (US)
Priority Data:
Title (EN) THERMAL RELIEF PAD
(FR) TAMPON DE SURPRESSION THERMIQUE
Abstract: front page image
(EN)A printed circuit board (PCB) having a thermal relief pad around at least one via. The thermal relief pad includes at least four of thermal cut-outs and at least four conductive bands. The at least four conductive bands are formed between the at least four thermal cut-outs such that adjacent conductive pads are orthogonal to each other. Each pair of mutually opposite conductive bands have substantially equal lengths and each pair of adjacent conductive bands have unequal lengths.
(FR)L'invention concerne une carte de circuit imprimé (PCB) comportant un tampon de surpression thermique autour d'au moins une interconnexion. Le tampon de surpression thermique inclut au moins quatre coupe-circuit thermiques et au moins quatre bandes conductrices. Les au moins quatre bandes conductrices sont formées entre les au moins quatre coupe-circuit thermiques de sorte que des tampons conducteurs adjacents soient orthogonaux les uns aux autres. Chaque paire de bandes conductrices mutuellement opposées ont des longueurs sensiblement égales et chaque paire de bandes conductrices adjacentes ont des longueurs inégales.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)