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Machine translation
1. (WO2015116076) PRINTED CIRCUIT BOARD FLUID EJECTION APPARATUS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/116076    International Application No.:    PCT/US2014/013730
Publication Date: 06.08.2015 International Filing Date: 30.01.2014
IPC:
B41J 2/045 (2006.01), B41J 2/14 (2006.01)
Applicants: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP [US/US]; 11445 Compaq Center Drive W Houston, Texas 77070 (US)
Inventors: LUTNESKY, Gary G; (US).
CHOY, Silam J; (US)
Agent: SAGALEWICZ, Angela M.; Hewlett-Packard Company Intellectual Property Administration 3404 E. Harmony Road, Mail Stop 35 Fort Collins, Colorado 80528-9599 (US)
Priority Data:
Title (EN) PRINTED CIRCUIT BOARD FLUID EJECTION APPARATUS
(FR) APPAREIL D'ÉJECTION DE FLUIDE À CARTE DE CIRCUIT IMPRIMÉ
Abstract: front page image
(EN)In an example, a fluid ejection apparatus includes a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, and a cavity. A printhead die may be embedded in a molding material in the cavity.
(FR)Dans un exemple, un appareil d'éjection de fluide comprend une carte de circuit imprimé comprenant une couche de conducteur, une couche de couverture formant une surface de la carte de circuit imprimé, et une cavité. Une matrice de tête d'impression peut être intégrée dans un matériau de moulage dans la cavité.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)