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1. (WO2015115716) FINGERPRINT RECOGNITION DEVICE, MANUFACTURING METHOD THEREFOR AND ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2015/115716 International Application No.: PCT/KR2014/008585
Publication Date: 06.08.2015 International Filing Date: 15.09.2014
IPC:
G06K 9/00 (2006.01)
Applicants: SAMSUNG ELECTRONICS CO., LTD.[KR/KR]; 129, Samsung-ro, Yeongtong-gu, Suwon-si Gyeonggi-do 443-742, KR
Inventors: KIM, Il; KR
MOON, Young Jun; KR
PARK, Tae Sang; KR
JANG, Kyung Woon; KR
OH, Seung Hee; KR
CHUNG, Chang Kyu; KR
LEE, Dong Yul; KR
Agent: SELIM INTELLECTUAL PROPERTY LAW FIRM; 10F and 11F, Taewoo Bldg. 285, Gangnam-daero Seocho-gu Seoul 137-862, KR
Priority Data:
10-2014-001140829.01.2014KR
10-2014-002572104.03.2014KR
Title (EN) FINGERPRINT RECOGNITION DEVICE, MANUFACTURING METHOD THEREFOR AND ELECTRONIC DEVICE
(FR) DISPOSITIF DE RECONNAISSANCE D'EMPREINTES DIGITALES ET SON PROCÉDÉ DE FABRICATION, ET DISPOSITIF ÉLECTRONIQUE
(KO) 지문인식장치와 그 제조방법 및 전자기기
Abstract: front page image
(EN) Disclosed are fingerprint recognition device having an improved structure to enable a driving device of an integrated circuit to have durability, a manufacturing method therefor, and an electronic device. The fingerprint recognition device can comprise: an integrated circuit electrically connected to at least one sensor electrode; a first circuit board located at an upper part of the integrated circuit and provided with the at least one sensor electrode; a second circuit board electrically connected to the first circuit board and located at a lower part of the integrated circuit; a molding layer provided at a lower part of the first circuit board to surround the integrated circuit so as to protect the integrated circuit from the outside; and a connection part electrically connecting the first circuit board and the second circuit board.
(FR) L'invention concerne un dispositif de reconnaissance d'empreintes digitales présentant une structure améliorée qui permet à un dispositif d'entraînement de circuit intégré de présenter une durabilité et son procédé de fabrication, et un dispositif électronique. Le dispositif de reconnaissance d'empreintes digitales peut comprendre : un circuit intégré connecté électriquement à au moins une électrode de capteur ; une première carte de circuit imprimé située sur la partie supérieure du circuit intégré et comprenant au moins une électrode de capteur ; une seconde carte de circuit imprimé connectée électriquement à la première carte de circuit imprimé et située sur la partie inférieure du circuit intégré ; une couche de moulage prévue sur la partie inférieure de la première carte de circuit imprimé pour entourer le circuit intégré de manière à la protéger depuis l'extérieur ; et une partie de connexion connectant électriquement la première carte de circuit imprimé et la seconde carte de circuit imprimé.
(KO) 집적회로의 구동소자가 내구성을 가지도록 개선된 구조를 가지는 지문인식장치와 그 제조방법 및 전자기기를 개시한다. 지문인식장치는 적어도 하나의 센서전극과 전기적으로 연결되는 집적회로, 상기 집적회로의 상부에 위치하고, 상기 적어도 하나의 센서전극이 마련되는 제 1회로기판, 상기 제 1회로기판과 전기적으로 연결되고, 상기 집적회로의 하부에 위치하는 제 2회로기판, 외부로부터 상기 집적회로를 보호하도록 상기 제 1회로기판 하부에 마련되어 상기 집적회로를 감싸는 몰딩층 및 상기 제 1회로기판 및 상기 제 2회로기판을 전기적으로 연결하는 연결부를 포함할 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)