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1. (WO2015115552) ADHESIVE COMPOSITION, RESIN CURED PRODUCT OBTAINED FROM ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING ADHESIVE COMPOSITION, AND SOLID-STATE IMAGING ELEMENT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/115552    International Application No.:    PCT/JP2015/052542
Publication Date: 06.08.2015 International Filing Date: 29.01.2015
IPC:
C09J 4/00 (2006.01), C09J 11/06 (2006.01), C09J 133/00 (2006.01), H01L 23/29 (2006.01), H01L 23/31 (2006.01), H01L 27/14 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP)
Inventors: IKEDA Aya; (JP).
FUJII Shinjiro; (JP).
KATOU Sadaaki; (JP).
KIKUCHI Syougo; (JP).
HASHIMOTO Shu; (JP)
Agent: HASEGAWA Yoshiki; (JP)
Priority Data:
2014-014863 29.01.2014 JP
Title (EN) ADHESIVE COMPOSITION, RESIN CURED PRODUCT OBTAINED FROM ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING ADHESIVE COMPOSITION, AND SOLID-STATE IMAGING ELEMENT
(FR) COMPOSITION ADHÉSIVE, PRODUIT DURCI DE RÉSINE OBTENU À PARTIR DE LA COMPOSITION ADHÉSIVE, PROCÉDÉ DE FABRICATION D'UN DISPOSITIF À SEMI-CONDUCTEURS UTILISANT LA COMPOSITION ADHÉSIVE, ET ÉLÉMENT D'IMAGERIE À SEMI-CONDUCTEURS
(JA) 接着剤組成物、接着剤組成物から得られる樹脂硬化物、接着剤組成物を用いた半導体装置の製造方法、及び固体撮像素子
Abstract: front page image
(EN)An adhesive composition containing (a) a compound having at least two ethylenically unsaturated groups, (b) a thermal polymerization initiator, (c) a hindered-phenol-based compound, (d) a thioether-based compound, and (e) a compound having a thiol group.
(FR)L'invention concerne une composition adhésive contenant: a) un composé comportant au moins deux groupes éthyléniquement insaturés; b) un initiateur de polymérisation thermique; c) un composé à base de phénol encombré; d) un composé à base de thioéther; et e) un composé comportant un groupe thiol.
(JA)(a)少なくとも2つのエチレン性不飽和基を有する化合物、(b)熱重合開始剤、(c)ヒンダードフェノール系化合物、(d)チオエーテル系化合物、及び、(e)チオール基を有する化合物、を含有する接着剤組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)