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1. (WO2015115528) CONDUCTIVE SUBSTRATE, CONDUCTIVE SUBSTRATE LAMINATE, METHOD FOR PRODUCING CONDUCTIVE SUBSTRATE, AND METHOD FOR PRODUCING CONDUCTIVE SUBSTRATE LAMINATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2015/115528    International Application No.:    PCT/JP2015/052474
Publication Date: 06.08.2015 International Filing Date: 29.01.2015
IPC:
G06F 3/044 (2006.01), B32B 15/04 (2006.01), G06F 3/041 (2006.01), H01B 5/14 (2006.01), H01B 13/00 (2006.01)
Applicants: SUMITOMO METAL MINING CO., LTD. [JP/JP]; 11-3, Shimbashi 5-chome, Minato-ku, Tokyo 1058716 (JP)
Inventors: HATA, Hiroki; (JP).
SHIGA, Daiki; (JP).
SUDA, Takahiro; (JP).
NISHIYAMA, Yoshihide; (JP)
Agent: ITOH, Tadashige; (JP)
Priority Data:
2014-017974 31.01.2014 JP
2014-176208 29.08.2014 JP
Title (EN) CONDUCTIVE SUBSTRATE, CONDUCTIVE SUBSTRATE LAMINATE, METHOD FOR PRODUCING CONDUCTIVE SUBSTRATE, AND METHOD FOR PRODUCING CONDUCTIVE SUBSTRATE LAMINATE
(FR) SUBSTRAT CONDUCTEUR, SUBSTRAT CONDUCTEUR STRATIFIÉ, PROCÉDÉ DE PRODUCTION D'UN SUBSTRAT CONDUCTEUR, ET PROCÉDÉ DE PRODUCTION D'UN SUBSTRAT CONDUCTEUR STRATIFIÉ
(JA) 導電性基板、積層導電性基板、導電性基板の製造方法、及び積層導電性基板の製造方法
Abstract: front page image
(EN)[Solution] Provided is a conductive substrate which comprises: a transparent base; a metal layer that is formed on at least one surface of the transparent base; and a blackening layer that is formed on the metal layer by a wet method.
(FR)[Solution] On décrit un substrat conducteur comprenant: une base transparente; une couche métallique formée sur au moins une surface de la base transparente; et une couche de noircissement formée sur la couche métallique par voie humide.
(JA)【解決手段】透明基材と、 前記透明基材の少なくとも一方の面上に形成された金属層と、 前記金属層上に湿式法により形成された黒化層と、を有する導電性基板を提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)